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Damage collaborative diagnosis technology based on multi-frequency-domain response signals

A technology of response signal and diagnosis technology, which is applied in the field of health monitoring of aerospace honeycomb sandwich thermal protection structure, can solve the problems of single monitoring technology, achieve the effect of broadening the frequency domain of response signal and saving energy

Pending Publication Date: 2021-10-08
DALIAN UNIV OF TECH +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, a single monitoring technology is used, which fails to achieve multi-technical fusion in each response frequency domain of the structure, and there is a certain degree of limitation in damage monitoring. Therefore, there is an urgent need for a multi-frequency domain response signal that can be used in cellular sandwich structures. Injury Collaborative Diagnosis Technology

Method used

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  • Damage collaborative diagnosis technology based on multi-frequency-domain response signals
  • Damage collaborative diagnosis technology based on multi-frequency-domain response signals
  • Damage collaborative diagnosis technology based on multi-frequency-domain response signals

Examples

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Embodiment

[0034] Embodiment: Using the method disclosed in the present invention to carry out an embodiment of multi-frequency domain collaborative damage monitoring of a honeycomb sandwich thermal protection structure, the specific diagnosis process includes:

[0035] First, the material of the honeycomb sandwich structure in this example is aluminum alloy, and the material density is 2.7g / cm 3 , elastic modulus 70GPa, Poisson's ratio 0.33, the geometric parameters of each layer are shown in Table 1. Polyimide film encapsulation of distributed optical sensors and piezoelectric sensors, as well as connecting circuits and circuit lights, integrating distributed optical fiber sensor networks between the skin panel and the honeycomb core, and between the strain isolation pad and the skin panel Integrated piezoelectric sensor arrays, such as figure 2 shown. Sensor layout position and preset damage settings such as image 3 , a distributed optical fiber sensor and 9 piezoelectric sensors...

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Abstract

The invention discloses a damage collaborative diagnosis technology based on a multi-frequency-domain response signal. The technology comprises the following steps: real-time low-frequency quasi-static strain monitoring can be carried out on a honeycomb sandwich multilayer thermal protection structure by adopting a distributed optical fiber sensor; a piezoelectric ceramic sensor is used for carrying out high-frequency ultrasonic guided wave active detection, polyimide film packaging is carried out on a sensor network and a connecting circuit, a distributed optical fiber sensor network is integrated between a skin panel and a honeycomb core, and a piezoelectric sensor array is integrated between a strain isolation pad and the skin panel; and the structure state is monitored in real time by comprehensively utilizing low-frequency quasi-static strain and high-frequency ultrasonic guided wave response, and when the structure state is abnormal, damage diagnosis is performed by adopting a high-frequency ultrasonic guided wave active detection method.

Description

technical field [0001] The invention relates to the field of health monitoring of aerospace honeycomb sandwich thermal protection structures, in particular to a damage collaborative diagnosis technology based on multi-frequency domain response signals. Background technique [0002] Reusable hypersonic vehicles have the characteristics of horizontal take-off and landing, wide-area flight, and repeated use, which will have a revolutionary impact on future air-space integrated operations. The aircraft requires its thermal protection system to be reusable under high overspeed reentry conditions, and is facing a huge challenge of high lightweight and high safety design. The honeycomb sandwich thermal multi-layer protective structure is a thermal protective structure that meets the above requirements. It is a multi-layer thermal insulation structure connected by heat-insulating honeycomb aluminum and panels, heat-resistant foam and other substrates through high-temperature resista...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N29/04G01B11/16
CPCG01N29/04G01B11/165G01N2291/0234
Inventor 武湛君李建乐黄念马寅魏张佳奇徐浩
Owner DALIAN UNIV OF TECH
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