Semiconductor automated testing machine

Abstract

The invention discloses a semiconductor automatic testing machine, which relates to the field of semiconductor technology, and includes a test main board and a control part arranged in the middle of one side of the test main board, and a protective part is arranged on the upper end of each test core part; The fire extinguishing assembly inside the protective shell is also provided with a pressure push assembly inside the protective shell, the pressure push assembly runs through the fire extinguishing assembly, and the upper end passes through the cover threaded on the upper end of the protective shell, and the middle part of the cover is fixedly provided with an alarm. The present invention The beneficial effect is not only to ensure that the test core itself will not be damaged too seriously, but also will not affect the surrounding test core, improve the self-protection ability of the test machine, remind the staff that the test core here is damaged, and deal with it in time , to further reduce the degree of damage to the test core components, the pressure push components will not return freely, and the buzzer alarm will continue to alarm until the staff finds out and deal with it in time.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a semiconductor automatic testing machine. Background technique [0002] Semiconductor refers to a material whose conductivity at room temperature is between that of a conductor and an insulator. Semiconductors have a wide range of applications in radios, televisions, and temperature measurement. For example, a diode is a device made of a semiconductor. A semiconductor is a material whose electrical conductivity can be controlled, ranging from an insulator to a conductor. No matter from the perspective of technology or economic development, the importance of semiconductors is enormous. In high-, low-temperature, and high-speed testing of semiconductor chips, multiple chips are usually tested at one time in order to improve efficiency. The signal sending and receiving device in the test system is composed of a semiconductor test board and multiple test core boards connec...

AI Technical Summary

Problems solved by technology

In the burn-in test, the semiconductor chip is usually tested with a large current and a faster reading speed than the normal use conditions, which will cause serious heating of each chip component of the test core board and affect the performance and life of the test core board.

[0003] However, today's semiconductor automated testing machines perform burn-in tests in extreme environments, and the number of tests is large and the test time is long. Under such conditions, sudden situations of short circuit or excessive heat often occur during the test. , which in turn causes the initial local damage of the testing instrument. Due to the untimely discovery, as the damage continues to increase, the entire testing machine will eventually be completely scrapped, causing great economic losses, and after the damage, part of the complete semiconductor Or the detection instrument is not easy to take out, and it is necessary to find suitable tools, which is troublesome to operate

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