A core bonding device for a lead frame
A lead frame and core bonding technology, which is applied in the field of core bonding devices for lead frames, can solve the problems of low bonding efficiency, increased work intensity of operators, and small number of chips, so as to improve automation, facilitate transfer operations, and improve The effect of storage
Active Publication Date: 2021-11-19
四川通妙科技有限公司
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Problems solved by technology
[0004] At present, there is difficulty in continuous feeding of the lead frame in the operation of sticking the core. It is inconvenient to position the lead frame during the feeding process, and the efficiency of sticking the core is low. The transfer movement also increases the work intensity of the operator, because the conventional bulk chip is placed by the operator constantly shaking the chip placement plate, so that the chip enters the hole of the chip placement plate, while the existing chip placement plate is placed Low number of chips negatively impacts die attach efficiency
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[0074] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.
[0075] Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art wi...
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A core bonding device for a lead frame, comprising: a support part, a feeding part, a feeding part, a transfer part, a placing part, a scraping part, a core moving part, a discharging part and a core setting part, and the feeding part is used for the lead frame. Place and transport the lead frame to move to the feeding part, the feeding part is used for conveying the lead frame and moving the lead frame to the transfer part, the transfer part is used for the positioning of the lead frame and the lead frame to the scraping part and the discharging part. Transfer, the scraping part is used for scraping the solder paste at the corresponding point of the lead frame, the core moving part moves the chip in the core part to the lead frame at the discharge part, and the core part is used for the placement of the lead frame and the sticking of the core. After the lead frame is removed, the core is used for the placement of multiple chips.
Description
technical field [0001] The invention relates to the related technical field of semiconductor back-stage processing equipment, in particular to a core bonding device for a lead frame. Background technique [0002] The manufacturing process of semiconductor components includes the front-end process, wafer processing process, wafer probe process, back-end, packaging and testing processes, etc., in which the front-end process, wafer processing process, and wafer probe process are chip processing processes, and then The segment, packaging and testing process is the packaging and forming process of semiconductors. [0003] The purpose of die bonding is to place individual chips on the lead frame and fix them with solder paste. After the core bonding is completed, the lead frame is sent to the curing furnace through the transmission equipment, and the chip and the lead frame are packaged with plastic or ceramics to form an integrated circuit. The purpose of this process is to crea...
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IPC IPC(8): H01L21/67H01L21/677
CPCH01L21/67144H01L21/67721H01L21/67706
Inventor 曾尚文陈久元杨利明刘高宸
Owner 四川通妙科技有限公司