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Flexible film and silicon microphone

A technology of silicon microphone and flexible membrane, which is applied in the direction of diaphragm structure, electrostatic transducer microphone, etc., can solve the problems of flexible membrane damage, microphone audio low-frequency response performance degradation, etc., to avoid mutual collision, improve low-frequency response performance, The effect of improved performance and reliability

Pending Publication Date: 2021-10-19
瑶芯微电子科技(上海)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a flexible membrane and a silicon microphone, which is used to solve the problem that the flexible membrane in the prior art is easily damaged when it is impacted by high pressure, and the use of multiple circular microphones If the hole constitutes a leaking channel, the audio low frequency response performance of the microphone will be degraded due to the strong leaking operation.

Method used

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Embodiment Construction

[0030] The implementation of the present invention will be illustrated by specific specific examples below, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0031] see Figure 1 to Figure 6 . It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for those who are familiar with this technology to understand and read, and are not used to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. within the scope covered by the disclosed technical content. At the same ti...

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Abstract

The invention provides a flexible film and a silicon microphone. The flexible film comprises a flexible film body and an air leakage structure located on the flexible film body. The air leakage structure comprises a first arc-shaped seam, a first straight seam, a second arc-shaped seam, a second straight seam, a third arc-shaped seam, a third straight seam and a fourth arc-shaped seam which are sequentially connected in a winding mode. The air leakage structure is in center symmetry with the midpoint of the second straight seam as the center. The chord length of the second arc-shaped seam is greater than the minimum distance between the first straight seam and the second straight seam; and the chord length of the third arc-shaped seam is larger than the minimum distance between the second linear seam and the third linear seam. According to the flexible film, the winding air release structure is arranged on the flexible film body, so that when the flexible film bears high air pressure impact, air can be quickly released through the air release structure, and the pressure needing to be borne by the flexible film is reduced. Moreover, the low-frequency response performance of the microphone can be improved, the damage risk of the air leakage structure can be reduced, and the reliability of the device can be improved.

Description

technical field [0001] The invention relates to an electronic device for acoustic-electric conversion, in particular to a flexible film and a silicon microphone prepared based on the flexible film. Background technique [0002] Today's smartphones and smart speakers use microphones made of silicon wafer technology. This microphone has the characteristics of small size, low power consumption, excellent performance, good consistency, and easy assembly. The core component of the silicon microphone is a layer of flexible membrane that can vibrate back and forth. The flexible membrane vibrates under the action of sound waves, resulting in changes in the distance between the flexible membrane and the backplane, which in turn changes the capacitance of the capacitive system, thereby transferring the sound waves The signal is converted into an electrical signal. During the manufacture of such a microphone and during the long-term operation of the microphone, the flexible membrane ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04H04R7/02
CPCH04R19/04H04R7/02
Inventor 王青松
Owner 瑶芯微电子科技(上海)有限公司