PCB board vacuum lamination device

Abstract

The invention relates to the field of circuit board processing, in particular to a vacuum lamination device for PCB boards, comprising a frame, a support table and a lamination mechanism, the support table is provided with grooves; the lamination mechanism includes a first lamination unit and a second lamination unit Unit, the first lamination unit includes a cylinder, a tension pressure sensor and a sliding plate, the sliding plate is connected to the cylinder through the tension pressure sensor, and the upper die and the sealing frame are fixed on the sliding plate, the upper die is located inside the sealing frame, and the upper The die is located directly above the groove, and a vacuum pump is arranged on the sealing frame; the second lamination unit includes a partition frame, a support plate and a pushing part, and the partition frame is located in the groove, and the partition frame divides the groove into an inner cavity and an interlayer cavity, the support plate is slidably arranged in the inner cavity, and the support plate can push the circuit board out of the inner cavity, and the size of the inner cavity matches the size of the circuit board; the sealing frame can be inserted into the interlayer cavity and push the support plate to move upward through the pushing part. When the technical solution is adopted, the vacuum degree is high, the pressing quality is high and the materials are convenient to take out.

Description

technical field [0001] The invention relates to the field of circuit board processing, in particular to a PCB board vacuum lamination device. Background technique [0002] PCB board is an important electronic component and a support for electronic components. PCB boards include rigid boards and flexible boards, such as FPC flexible circuit boards. Flexible boards require less pressing force during lamination, and need to be vacuumized to prevent the glue on adjacent flexible boards from generating air bubbles during lamination. And the compaction is not solid; while the rigid board does not need vacuum treatment, and requires a large pressing force. As a result, different lamination devices are required for the production of rigid boards and flexible boards, which undoubtedly increases the production cost of PCB boards. [0003] In order to solve the above-mentioned defects, the prior art adjusts the different pressures when pressing the rigid board and the flexible board ...

AI Technical Summary

Problems solved by technology

[0004] However, there is a problem with this method, that is, when the PCB boards are placed one by one in the groove of the support table for vacuuming and pressing, if in order to improve the placement accuracy of each PCB board, the size of the PCB board should be consistent with the groove. The dimensions match, that is, the area should be the same size, so that the PCB board fills the groove, but it is not convenient to vacuum the air between the adjacent PCB boards, that is, the vacuum degree is low, which affects the quality of the lamination, and it is not easy to press after the lamination is completed. It is convenient to take out the PCB board; if the size of the PCB board is required to be smaller than the size of the groove for high vacuum and easy removal, the groove cannot position the PCB board well, and adjacent PCB boards are prone to appear when pressing the PCB board If the board alignment accuracy is not high, it will also affect the pressing quality of the PCB board

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