Ultrathin material etching device

Abstract

The invention discloses an ultrathin material etching device. The device includes a first etching groove, a second etching groove, a material roll conveying mechanism, a first spraying mechanism and a second spraying mechanism; the first etching groove and the second etching groove are arranged side by side; and the material roll conveying mechanism is used for conveying and supporting a material to be etched to sequentially enter the first etching groove and the second etching groove so that the material to be etched can be subjected to front face etching in the first etching groove and back face etching in the second etching groove. According to the ultrathin material etching device, spraying is carried out through the spraying mechanisms, the other surface is etched after one surface is etched, no residual etching liquid is left, and the etching precision is improved. Through the material roll conveying mechanism, an etching material can enter the first etching groove and the second etching groove for etching in a supporting manner, the wrinkling phenomenon is avoided, and etching is uniform; in addition, the etching device provided by the invention does not need to be clamped by a clamping plate, so that the non-uniform tension of the material to be etched is avoided, and the etching is uniform.

Description

technical field [0001] The invention relates to the technical field of etching, in particular to an ultra-thin material etching device. Background technique [0002] Common etching machines include chemical etching and electrolytic etching. In chemical etching, chemical solutions are used to achieve the purpose of etching through chemical reactions. Etching machines are widely used in aerospace, machinery, signage and other industries to etch ultra-thin circuit boards, microporous metal coils, and precision shielding materials. [0003] When the existing etching machine etches ultra-thin materials, the material to be etched is horizontally conveyed into the etching tank through multiple rollers, and the etching solution is immersed in the material to be etched to perform double-sided etching (that is, etching is performed on both sides at the same time). When the etching material enters the etching tank, both sides of the material to be etched are clamped by splints to keep...

AI Technical Summary

Problems solved by technology

[0005] 1) Since the etching material is etched on both sides at the same time, the etching solution has a certain buoyancy and will fluctuate, which will lead to uneven etching of the material

[0006] 2) During the process of the roller conveying the material to be etched, the roller will generate tensile stress on the material to be etched. Since the material to be etched is extremely thin, the rear of the material to be etched is prone to uneven tension, resulting in rear wrinkling. Wrinkling occurs on the front, which leads to uneven etching

[0007] 3) Since both sides of the material to be etched are clamped by multiple splints arranged side by side, and the clamping force of the splints is not uniform, it will lead to uneven tension of the material to be etched, resulting in uneven etching

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