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A prefabrication process for coil pins

A coil and pin technology, which is applied in the field of coil pin prefabrication, can solve the problems such as the collapse of the outer surface of the inductor, and achieve the effects of avoiding the collapse of the inductor, improving the yield rate, and enhancing the magnetic conductivity.

Active Publication Date: 2022-07-22
合泰盟方电子(深圳)股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the related technologies mentioned above, the inventor believes that the related technologies have the following defects: the inductors of the existing technology need to be bent many times, and the outer surface of the inductor is prone to collapse and cracking during the bending process

Method used

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  • A prefabrication process for coil pins
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  • A prefabrication process for coil pins

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Embodiment Construction

[0040] Attached to the following Figure 1-3 This application will be described in further detail.

[0041] The embodiment of the present application discloses a prefabrication process for coil pins. The prefabrication process of the coil pins includes the following steps:

[0042] S1, prefabricated T buckle 1 and carrier tape 2:

[0043] refer to figure 1 and figure 2 , put the metal plate into the corresponding punching die, and punch out the carrier tape 2. The carrier tape 2 consists of a plurality of mutually spliced ​​supporting frames 21, two connecting bars 22 arranged in each supporting frame 21 and The extension piece 23 used to connect the two connecting bars 22 and the inner side wall of the support frame 21 is composed. The support frame 21 is composed of two positioning bars which are parallel and opposite to each other, and are erected between the two positioning bars and used to separate adjacent ones. The support strips of the two extension sheets 23 are...

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Abstract

The present application relates to a prefabrication process for coil pins, which includes prefabricating T-buckles and carrier tapes, assembling processes, punching and welding, powder thermoforming, cutting and forming, insulation treatment and contact electroplating process steps. The snare is set on the central column of the T-buckle, and the T-buckle with the coil is assembled with the carrier tape, and then the length of the coil pin is shortened to a certain length and fixed with the connecting strip on the carrier tape. In the process of one-piece thermoforming, the connecting bar, T-buckle and coil are wrapped in the formed inductor body, and one side of the connecting bar is exposed outside the inductor body as a contact point of the inductor, and then the carrier tape and the inductor body are cut off. At the connection, the surface of the inductor body except the contact area is insulated, and the contact area is electroplated. The present application has the advantages of not needing to bend the coil pins, avoiding the phenomenon of inductance cracking caused by the bending process, and improving the yield of the inductance.

Description

technical field [0001] The present application relates to the field of inductor manufacturing processes and equipment, and in particular, to a prefabrication process for coil pins. Background technique [0002] Inductance, also known as inductor or inductive coil, is one of the basic elements that make up electronic circuits. The inductor structure mainly includes an inductor body, a coil wrapped inside the inductor body, and two coil pins that are fixedly connected to the coil and extend to the outside of the inductor body. [0003] In the existing inductance production process, the coil pins are mostly pressed into a flat shape, and then a certain amount of metal powder is added to the cavity of the powder forming mold, and then the coil is placed in the cavity and the metal is added again. The powder covers the coil, and after the powder is pressed and molded to form the inductor, the coil pins are bent many times to make the flat pins of the coil fit on the outer surfac...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F41/04
CPCH01F41/04
Inventor 高涛邹松青彭美文
Owner 合泰盟方电子(深圳)股份有限公司
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