Production method for preventing solder ball from falling off and abnormally escaping
A production method and technology of solder balls, which are applied in the production field of preventing abnormal escape of solder balls, can solve problems such as inappropriateness, poor combination of aluminum pads and solder balls, solder balls falling off and crimping output energy, etc., to improve Yield rate and product reliability, and the effect of preventing abnormal escape of solder balls
Pending Publication Date: 2021-10-22
HUATIAN TECH XIAN
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Problems solved by technology
[0002] Solder ball shedding is a phenomenon that occurs when the chip is bonded during the packaging process. The main reason for the solder ball shedding is that the output energy of the crimping is not suitable, so that the aluminum pad and the solder ball in the chip bonding area cannot be well combined, resulting in poor ball bonding. reliable
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[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, those skilled in the art can also obtain other embodiments without making creative efforts.
[0029] see figure 1 , the present invention proposes a production method for preventing solder balls from falling off and escaping abnormally, comprising the following steps:
[0030] Step 1, see figure 2 , 3 , Use a pick under the operating microscope to pick off the end of all the solder wires near the solder ball.
[0031] Step 2, pull out the welding wire from the uncut end of the welding wire. see Figure 4 , 5. Clamp the welding wire with tweezers and apply force, and pull up the welding wire to separate it from th...
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The invention provides a production method for preventing a solder ball from falling off and abnormally escaping. The production method comprises the following steps: 1, cutting off one ends, close to the solder ball, of all bonding wires; 2, pulling out the bonding wire from one end, which is not cut off, of the bonding wire; 3, determining whether the solder ball with the solder wire removed falls off or not. According to the method, firstly, the ends, close to the solder balls, of all the bonding wires are cut off, and a tension experiment is simulated in the process that the uncut ends of the bonding wires pull out the bonding wires, so that whether the solder balls of all the bonding wires fall off abnormally or not can be found in time. Therefore, whether the solder balls abnormally fall off from all the bonding wires or not can be recognized in advance through the method; therefore, by effectively preventing the solder balls from falling off and abnormally escaping, the yield and the product reliability of a production line are improved.
Description
technical field [0001] The invention belongs to the field of packaging, and in particular relates to a production method for preventing solder balls from falling off and escaping abnormally. Background technique [0002] Solder ball shedding is a phenomenon that occurs when the chip is bonded during the packaging process. The main reason for the solder ball shedding is that the output energy of the crimping is not suitable, so that the aluminum pad and the solder ball in the chip bonding area cannot be well combined, resulting in poor ball bonding. reliable. [0003] In the production process, there are many reasons for the solder ball falling off, such as improper setting of process parameters during the bonding process, contamination of the bonding area of the chip before bonding, contamination of the welding wire, poor probe printing, lack of aluminum, etc. [0004] Therefore, how to avoid the phenomenon of abnormal escape of solder balls in the production of such prod...
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IPC IPC(8): H01L21/66H01L21/48
CPCH01L21/4885H01L21/4814H01L22/20
Inventor 王旭马勉之
Owner HUATIAN TECH XIAN