Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Processing unit, related device, and tensor calculation method

A processing unit and computing unit technology, applied in computing, computing models, electrical components, etc., can solve problems such as reducing the computing energy efficiency of the processing unit, inability to calculate efficiently, and unmatched external environment bandwidth and computing power of the processing unit.

Active Publication Date: 2021-10-22
平头哥上海半导体技术有限公司
View PDF10 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the bandwidth of the external environment is low, the multicast data input mode cannot be used for efficient calculation, and the idle waiting state of the computing unit is often
When the bandwidth of the external environment is high, the pulse data input mode cannot fully utilize the bandwidth and resources
These all cause the external environmental bandwidth and computing power of the processing unit to be unsuitable, reducing the computing energy efficiency of the processing unit

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Processing unit, related device, and tensor calculation method
  • Processing unit, related device, and tensor calculation method
  • Processing unit, related device, and tensor calculation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0041] The present disclosure is described below based on examples, but the present disclosure is not limited only to these examples. In the following detailed description of the disclosure, some specific details are set forth in detail. The present disclosure can be fully understood by those skilled in the art without the description of these detailed parts. In order to avoid obscuring the essence of the present disclosure, well-known methods, procedures, and procedures are not described in detail. Additionally, the drawings are not necessarily drawn to scale.

[0042] The following terms are used in this document.

[0043]Deep learning model: Deep learning is a new research direction in the field of machine learning (ML, Machine Learning). It is introduced into machine learning to make it closer to the original goal-artificial intelligence (AI). Deep learning learns the internal laws and representation levels of sample data, and the information obtained during the learnin...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a processing unit, a related device and a tensor calculation method. The processing unit comprises a plurality of calculation units which form a calculation matrix with n rows and m columns, and n and m are non-zero natural numbers; a computing unit controller which is used for controlling the computing matrix to work in a multicast data input mode under the condition that the bandwidth of the external environment where the processing unit is located meets the preset bandwidth requirement, wherein data is broadcasted to all the computing units in the corresponding columns according to the columns and broadcasted to all the computing units in the corresponding rows according to the rows, and under the condition that the external environment bandwidth does not meet the preset bandwidth requirement, the calculation matrix is controlled to work in a pulse data input mode, and the calculation units receive data from the calculation units in the same row of the previous column and the calculation units in the previous row of the same column so as to support tensor operation. According to the embodiment of the invention, the working mode of the calculation matrix is flexibly configured according to the external environment bandwidth of the processing unit, so that the external environment bandwidth of the processing unit is adaptive to the calculation capability, and the calculation energy efficiency of the processing unit is improved.

Description

technical field [0001] The present disclosure relates to the field of chips, and in particular, to a processing unit, a related device, and a tensor operation method. Background technique [0002] Deep learning is currently widely used in face recognition, speech recognition, automatic driving and other fields. Since deep learning relies on a large number of repeated tensor operations such as convolution and matrix operations, traditional hardware is inefficient in executing the corresponding algorithms. Therefore, a computing architecture dedicated to executing them has emerged as the times require. The deep learning processing units in these architectures employ computational matrices composed of multiple computational units. Each calculation unit in the calculation matrix performs convolution and operation of elements in the matrix operation, and then accumulates the operation results to obtain the tensor operation result. There are generally two ways to transmit the el...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H04W4/06H04W28/20H04W84/08G06N3/04G06N3/063G06N20/00
CPCH04W4/06H04W28/20H04W84/08G06N3/063G06N20/00G06N3/045Y02D30/70
Inventor 范虎劳懋元阎承洋李玉东
Owner 平头哥上海半导体技术有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products