Laminating method of copper-clad plate and circuit board

A technology for copper clad laminates and circuit boards, which is used in multilayer circuit manufacturing, circuit lamination, printed circuits, etc., can solve the problems affecting the uniformity of dielectric thickness and the bending deformation of the core board, so as to ensure the uniformity and alleviate the bending deformation. effect of stress

Active Publication Date: 2021-10-22
SHENNAN CIRCUITS
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  • Claims
  • Application Information

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Problems solved by technology

[0004] This application provides a method for laminating copper-clad laminates and a circuit board to solve the problem that in the prior art, when the copper-clad laminates are laminated, the deformation is concentrated in the board, resulting in local bending and deformation of the core board, thereby affecting the thickness of the core board. uniformity problem

Method used

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  • Laminating method of copper-clad plate and circuit board
  • Laminating method of copper-clad plate and circuit board
  • Laminating method of copper-clad plate and circuit board

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Embodiment Construction

[0020] In order to make the technical problems solved by the present application, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present application will be further described in detail below in conjunction with the accompanying drawings.

[0021] Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The occurrences of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is understood explicitly and implicitly by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0022] see figure 1 , figure 1 It is a schematic flow chart of the first embodiment of...

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Abstract

The invention discloses a lamination method of copper-clad plates and a circuit board, and the method comprises the steps: providing at least two copper-clad plates, and carrying out the punching of each copper-clad plate; milling a first connecting bridge and a second connecting bridge which are symmetrically arranged according to the center of the punched hole at the peripheral position of the punched hole of each copper-clad plate; aligning at least two copper-clad plates through punching so as to be arranged in a laminated manner; laminating at least two copper-clad plates arranged in a stacked manner, wherein the first connecting bridge and the second connecting bridge are used for relieving deformation pressure in the laminating process of the at least two copper-clad plates. Through the mode, the first connecting bridge and the second connecting bridge are milled on the periphery of the punched hole of each copper-clad plate, so that the deformation pressure in the laminating process of at least two copper-clad plates can be relieved, the pressure of local bending deformation of each copper-clad plate is relieved, and the uniformity of the dielectric thickness of the laminated copper-clad plates is ensured.

Description

technical field [0001] The present application relates to the technical field of circuit board lamination technology, in particular to a method for laminating copper-clad laminates and circuit boards. Background technique [0002] Nowadays, with the development of 5G technology, the requirements for the production process of circuit boards are getting higher and higher. Among them, the thickness uniformity has a great influence on the signal, and the circuit board thickness tolerance of conventional production in the industry is ±10%, which can no longer meet the needs of actual products, so it is necessary to control the thickness tolerance at a stricter level within range. [0003] Among them, in the lamination process of multi-layer circuit boards, since multiple circuit boards need to be pressed together, they need to be aligned first to prevent side slipping, and tools such as rivets or pins need to be added to them. position. And because different circuit boards are...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/4638H05K2203/06
Inventor 杨之诚廖志强林淡填
Owner SHENNAN CIRCUITS
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