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Photosensitive resin composition, photosensitive resin sheet, cured film, method for producing cured film, organic el display device and electronic component

A technology of photosensitive resin and photosensitive compound, which is applied in the field of photosensitive resin composition, can solve the problems of high temperature resistance of sealing resin, and achieve the effects of high long-term reliability, good imidization rate, and high pattern processability

Pending Publication Date: 2021-10-22
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for example, MRAM (Magnetoresistive Random Access Memory; magnetoresistive memory), which is expected to be a next-generation memory, and sealing resin are not resistant to high temperatures.

Method used

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  • Photosensitive resin composition, photosensitive resin sheet, cured film, method for producing cured film, organic el display device and electronic component
  • Photosensitive resin composition, photosensitive resin sheet, cured film, method for producing cured film, organic el display device and electronic component
  • Photosensitive resin composition, photosensitive resin sheet, cured film, method for producing cured film, organic el display device and electronic component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0207] Hereinafter, although an Example etc. are given and this invention is demonstrated, this invention is not limited to these examples. In addition, each evaluation in an Example was performed by the following method.

[0208] (1) Imidization rate

[0209] The varnish obtained in each of the Examples and Comparative Examples was coated on a silicon wafer by a spin coating method at an arbitrary rotation speed using a spin coater (MS-A100; manufactured by Mikasa Co., Ltd.). Next, it baked at 120 degreeC for 2 minutes using the hot plate (SCW-636; Dainippon Sky Co., Ltd. product), and produced the pre-baked film with a film thickness of 2.0 micrometers. In addition, the film thickness was measured using Lambda Ace STM-602 manufactured by Dainippon Screen Manufacturing Co., Ltd. under the condition of a refractive index of 1.63. The obtained prebaked film was cut into three pieces, the first piece was not subjected to any treatment, and the second piece was heated at 200° C...

Synthetic example 1

[0223] Synthesis Example 1 Synthesis of Hydroxyl-Containing Diamine Compound (α)

[0224] Dissolve 18.3 g (0.05 mol) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (hereinafter referred to as BAHF) in 100 mL of acetone, 17.4 g (0.3 mol) of propylene oxide, and cool to -15 ℃. A solution obtained by dissolving 20.4 g (0.11 mol) of 3-nitrobenzoyl chloride in 100 mL of acetone was added dropwise thereto. After the dropwise addition was completed, it was allowed to react at -15°C for 4 hours, and then returned to room temperature. The precipitated white solid was separated by filtration and dried under vacuum at 50°C.

[0225] 30 g of the solid was added to a 300 mL stainless steel autoclave, dispersed in 250 mL of methyl cellosolve, and 2 g of 5% palladium-carbon was added. Hydrogen gas is introduced into it with a balloon, and the reduction reaction is carried out at room temperature. After about 2 hours, it was confirmed that the balloon was no longer deflated and the...

Synthetic example 2

[0227] Synthesis of Synthetic Example 2 Quinone Diazo Compound (c-1)

[0228] Under a dry nitrogen stream, 21.22 g (0.05 mol) of TrisP-PA (trade name, manufactured by Honshu Chemical Industry Co., Ltd.) and 36.27 g (0.135 mol) of 5-naphthoquinonediazosulfonyl chloride were dissolved in 1,4- two Alkane 450g, set to room temperature. In it, dropwise add 1,4-bis 15.18 g of triethylamine mixed with 50 g of alkane. After the dropwise addition, it was stirred at 30° C. for 2 hours. The triethylamine salt was filtered, and the filtrate was poured into water. Then, the deposited precipitate was collected by filtration. This precipitate was dried with a vacuum dryer to obtain a quinonediazo compound (c-1) represented by the following formula.

[0229]

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Abstract

The present invention addresses the problem of providing a photosensitive resin composition which exhibits good imidization rate even in cases where the photosensitive resin composition is fired at a temperature of 200 DEG C or less, while having high pattern processability, and a cured film of which exhibits high long-term reliability if used in an organic EL display device. In order to solve the above-described problem, the photosensitive resin composition according to the present invention contains (a) a polyimide precursor, (b) a phenolic compound having an electron-withdrawing group and (c) a photosensitive compound; and the polyimide precursor (a) has a residue which is derived from a diamine that has an ionization potential of less than 7.1 eV.

Description

technical field [0001] The present invention relates to a photosensitive resin composition that can be suitably used for a flattening layer of an organic EL display device, an insulating layer, an interlayer insulating layer of an electronic component, a surface protective layer, and the like. Background technique [0002] Among display devices having thin displays such as smartphones, tablet PCs, and televisions, many products using organic electroluminescent (hereinafter, "organic EL") display devices have been developed. Generally speaking, an organic EL display device has a driving circuit, a planarization layer, a first electrode, an insulating layer, a light-emitting layer, and a second electrode on a substrate, and a voltage can be applied between the opposing first electrode and the second electrode And glow. Among them, a photosensitive resin composition capable of forming a pattern by ultraviolet irradiation is generally used as a material for a planarizing layer ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/023G03F7/20G03F7/40G09F9/30H01L27/32H01L51/50H05B33/22
CPCG03F7/40G09F9/30H05B33/22G03F7/0226G03F7/0233H10K71/233G03F7/004G03F7/20H01L23/5329H10K59/122H10K59/124
Inventor 小森悠佑鹫见岳三好一登
Owner TORAY IND INC