Dynamic monitoring equipment for sintering process of flexible ink-jet printing metal nano ink
A metal nanometer, inkjet printing technology, applied in the direction of measuring devices, instruments, etc., can solve the problems such as the influence of ink sintering performance is not well considered comprehensively, the ink sintering performance is ignored, and the actual performance parameters of nano ink cannot be provided. , to achieve the effect of precise sintering temperature control
Pending Publication Date: 2021-10-26
嘉兴南湖学院 +1
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[0003] When the printing equipment is printing, the uniformity of the pattern printing and the difference in the sintering effect during the sintering process make the measured performance of the sintered sample quite different from the actual performance. At the same time, during the preparation process of each component of the ink, the parameters of each component The impact on the sintering performance of the ink has not been well considered comprehensively, and the actual performance parameters during the sintering process of the nano-ink have not been provided, resulting in the neglect of the actual sintering performance of the ink during sintering of the nano-ink. Therefore, how to realize the performance parameters of the ink during the sintering process The measurement of the index and the in-depth study of the actual sintering performance of the ink during the sintering process is a huge challenge in the field of printed electronics technology
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[0023] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0024] In order to solve the problems of metal nano-ink preparation, ink actual sintering performance and dynamic monitoring during the sintering process, the resistance of the ink at different sintering temperatures and the change rule of the resistance with the sintering temperature were studied, and the dynamic monitoring of the entire sintering process of the ink was carried out; according to The measured resistance value can further obtain the dynamic thermal conductivity of the nano-ink at different sintering temperatures, which can be used in the software simulation of the sintering process, ...
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The invention relates to the technical field of flexible electronic industry production, in particular to dynamic monitoring equipment for the sintering process of flexible ink-jet printing metal nano ink. According to the device, ink is injected into the standard sample template through the high-precision injection device, the standard sample template is heated through the precise temperature control platform, meanwhile, the resistance change condition of the standard sample template is monitored in real time through the resistance measuring device, and real-time video monitoring is conducted through the video monitoring device; and the sintering resistance and the heat conductivity coefficient are measured in real time, the sintering temperature is accurately controlled, and the resistivity and the heat conductivity coefficient of the sintering pattern of the metal nano conductive ink at different temperatures can be accurately obtained.
Description
technical field [0001] The invention relates to the technical field of flexible electronic industry production, in particular to a dynamic monitoring device for the sintering process of flexible inkjet printing metal nano-ink. Background technique [0002] At present, the technical research on printing and sintering of flexible electronic circuits is mainly concentrated in various printed electronics fields, mainly on the printing performance and conductivity of ink. The research on the printing performance and conductivity of ink mainly focuses on ink configuration and printing with various printing equipment, and then use the sintering method to conduct the conductive circuit, and use the conductive performance of the conductive wire as the printing performance and conductivity of the ink. [0003] When the printing equipment is printing, the uniformity of the pattern printing and the difference in the sintering effect during the sintering process make the measured perform...
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Login to View More IPC IPC(8): G01D21/02
CPCG01D21/02
Inventor 于志恒黄风立汤成莉张天成王殿梁王公海
Owner 嘉兴南湖学院