Pressure sensor chip, high-pressure-resistant pressure sensor and manufacturing method of high-pressure-resistant pressure sensor

Abstract

The invention discloses a pressure sensor chip, a high-pressure-resistant pressure sensor and a manufacturing method of the high-pressure-resistant pressure sensor. The pressure sensor chip comprises a glass substrate, a bonding pad assembly and a silicon pressure strain gauge. The pad assembly is disposed on the glass substrate and includes a first pad and a second pad. Two silicon pressure strain gauges are both installed on the glass substrate and located on the two sides of the bonding pad assembly respectively. Each silicon pressure strain gauge comprises a silicon strain sheet and a P-type piezoresistive sheet. And a plurality of P-type piezoresistive sheets are arranged on the silicon strain sheets side by side. The same ends of every two adjacent P-type piezoresistive sheets are electrically connected, so that the P-type piezoresistive sheets are sequentially connected in series. The two silicon pressure strain gauges are connected in series through the first bonding pad, and signal lines are led out through the two second bonding pads respectively. The high voltage resistance of the pressure sensor is improved by using the high voltage resistance of the glass and the stability of the glass bonded with the silicon.

Description

Technical field [0001] The present invention belongs to a pressure detecting apparatus in a harsh environment, and is specifically related to the design and fabrication of pressure sensors to achieve high pressure, non-easy breakdown in a high voltage working environment. Background technique [0002] In recent years, the demand for high-voltage power sensors in industrial climate control systems or HVAC systems has increased significantly. In these systems, traditional pressure switches are relatively low, used as safety and monitoring devices of protection equipment, such as air filters, fan heaters, cooling circuits, and fire baffles, have been replaced by pressure sensors, but existing stress The sensor has a high breakdown voltage and complex package structure, thereby reducing the sensitivity of the pressure sensor. Therefore, a silicon strain pressure sensor with a high dielectric strength glass substrate is a substrate and a packaging method, which solves the problem of p...

AI Technical Summary

Problems solved by technology

In these systems, traditional pressure switches are less accurate and are used as safety and monitoring devices to protect equipment, such as air filters, fan heaters, cooling circuits, and fire dampers, and have been replaced by pressure sensors. However, the existing pressure The sensor has a high breakdown voltage and complex packaging structure, which reduces the sensitivity of the pressure sensor

Therefore, a silicon strain pressure sensor with a high dielectric strength glass substrate as a substrate and a packaging method are proposed to solve the problem of pressure sensing in a high voltage environment.

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