Method, device and system for decomposing layout of semiconductor structure and storage medium

Abstract

The invention provides a method, a device and a system for decomposing the layout of a semiconductor structure and a storage medium. The method comprises the following steps: forming a to-be-decomposed structural layout original graph based on the layout of a semiconductor structure at a preset section; obtaining a plurality of sub-graphs comprising at least one part of the structural layout original graph based on the structural layout original graph; clustering the invariant moments of the plurality of sub-graphs to obtain a plurality of classes containing the invariant moments; and classifying the sub-graphs corresponding to the invariant moments in the same class into the same set so as to select feature sub-graphs from all the sub-graphs in each set.

Description

technical field

[0001] The present application relates to the field of image processing, and more particularly, to a method, device, system and storage medium for decomposing the layout of a semiconductor structure. Background technique

[0002] In the field of semiconductor manufacturing, designers need to design large, complex layouts. Designers often employ design-for-manufacturing (DFM) techniques to improve design robustness to further improve product reliability and increase manufacturing yield.

[0003] Any DFM recommendation that may be of value to a designer must provide an accurate prediction of how a particular design will be fabricated under different expected process conditions. Achieving this predictive capability requires an understanding of process windows at all stages of the design flow. Lithography Friendly Design (LFD) captures information such as how the design will respond to lithography window effects during fabrication. This knowledge enables desig...

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