Wafer thinning equipment for 5G communication optical chip SIP packaging and using method thereof

Abstract

The invention discloses wafer thinning equipment for 5G communication optical chip SIP packaging and a using method thereof. The wafer thinning equipment comprises a base table body used for bearing the wafer thinning equipment; the top end of the base table body is fixedly connected with a bearing protection coaming; the interior of the bearing protection coaming is connected with a bearing table used for placing a wafer; a thinning supporting arm is arranged on one side of the bearing table; a lifting rod is fixedly connected to the bottom end of the thinning supporting arm; a clamping structure is connected to the lower portion of the lifting rod and used for being connected with a thinning grinding wheel; the thinning grinding wheel is arranged below the clamping structure and used for thinning the wafer; and a water liquid circulating structure is arranged in the base table body, and used for recycling water liquid. By means of the arranged clamping structure, the thinning grinding wheel can be rapidly detached from the interior of the device, then the replacement efficiency of the thinning grinding wheel is improved, and the using effect is improved.

Description

technical field [0001] The invention relates to the technical field of 5G communication, in particular to wafer thinning equipment for SIP packaging of 5G communication optical chips and a method for using the same. Background technique [0002] The 5G communication module is to package the baseband chip, radio frequency, storage, power management and other hardware, and provide external packaging methods such as LCC / Mini PCIE / M.2, and provide standard AT and other software interfaces. End customers do not need to pay too much attention For internal details, 2 / 3 / 4 / 5G network connections can be made using standard interfaces or commands. [0003] When the wafers on the market are processed shallowly, the grinding wheel is replaced by tools, and the process is relatively complicated. At the same time, the spraying water is used, which wastes a lot of water resources and is not environmentally friendly. Contents of the invention [0004] The purpose of the present invention ...

AI Technical Summary

Problems solved by technology

[0003] When the wafers on the market are processed shallowly, the grinding wheel is replaced by tools, and the process is relatively complicated. At the same time, the spraying water is used, which wastes more water resources and is not environmentally friendly.

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