Deep temperature measuring method and device based on thermal impulse method, and earphone

A deep temperature and measurement method technology, applied in the direction of measuring devices, thermometers, measuring heat, etc., can solve the problems of low measurement accuracy and large error in human body deep temperature measurement, and achieve accurate deep temperature data, eliminate estimation errors, and accurate measurement. Effect

Active Publication Date: 2021-10-29
嘉兴温芯智能科技有限公司
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present application provides a deep temperature measurement method, device and earphone based on the thermal shock method, which solves the problems of large measurement errors and low measurement accuracy in the deep temperature of the human body existing in the prior art. The real-time thermal response characteristic parameters under impulse conditions are used to calculate the deep temperature data of the detection target, which not only strips the influence of environmental factors on the deep temperature, but also eliminates the estimation error caused by individual differences, and can measure the deep temperature data more accurately , to meet the needs of different users

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Deep temperature measuring method and device based on thermal impulse method, and earphone
  • Deep temperature measuring method and device based on thermal impulse method, and earphone
  • Deep temperature measuring method and device based on thermal impulse method, and earphone

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] figure 1 Shown is a schematic structural diagram of a deep temperature measurement device based on the heat shock method provided in the embodiment of the present application, such as figure 1 As shown, the deep temperature measurement device based on the heat shock method includes:

[0036] a heating module, a first temperature sensor and a temperature processor;

[0037] The heating module is arranged on the side close to the first temperature sensor, and is used to form a specific heat shock condition for the first target temperature measurement point; the first temperature sensor is used to collect the temperature of the first target temperature measurement point The temperature data under the specific heat shock condition; the temperature processor is connected to the first temperature sensor, and is used to obtain the thermal response characteristic parameters according to the temperature data, and is also used to obtain the thermal response characteristic parame...

Embodiment 2

[0049] figure 2 Shown is a schematic structural diagram of another deep temperature measurement device based on the heat shock method provided in the embodiment of the present application, as figure 2 As shown, on the basis of the solution in Embodiment 1, a target temperature measurement point (ie, the second target temperature measurement point) and a temperature sensor (ie, the second temperature sensor) are added, and the first temperature sensor is set on the first target The temperature measurement point is used to collect the outer surface temperature of the detection target, the second temperature sensor is arranged at the second target temperature measurement point, and is used to collect the ambient temperature away from the outer surface of the detection target; the heating module is arranged near One side of the second temperature sensor is used to form a heat shock condition for the first target temperature measurement point and the second target temperature mea...

Embodiment 3

[0064] image 3 Shown is a schematic flow chart of a deep temperature measurement method based on the heat shock method provided in the embodiment of the present application, as shown in image 3 As shown, the measurement method adopted by the above-mentioned deep temperature measurement device based on the heat shock method specifically includes the following steps:

[0065] Step S101, obtaining thermal response characteristic parameters of at least one target temperature measurement point under specific heat shock conditions;

[0066] In this example, if Figure 4 As shown, obtaining the thermal response characteristic parameters of at least one target temperature measurement point under specific heat shock conditions specifically includes the following steps;

[0067] Step S201, under unheated conditions, obtain the unheated temperature sequence of the at least one target temperature measurement point at thermal equilibrium;

[0068] Step S202, start the heating module, ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a deep temperature measurement method and device based on a thermal impulse method, and an earphone. The measurement method comprises the steps: obtaining a thermal response characteristic parameter of at least one target temperature measurement point under a specific thermal impulse condition; acquiring deep temperature data of the detection target according to the thermal response characteristic parameters. The problems that in the prior art, the human body deep temperature measurement error is large, and the measurement precision is low are solved, the deep temperature data of the detection target are calculated through the real-time thermal response characteristic parameters of at least one target temperature measurement point under the thermal impulse condition, the influence of environmental factors on the deep temperature is eliminated, estimation errors caused by individual differences are eliminated, deep temperature data can be measured more accurately, and the requirements of different users are met.

Description

technical field [0001] The invention relates to the technical field of temperature measurement, in particular to a deep temperature measurement method, device and earphone based on a thermal shock method. Background technique [0002] With the improvement of people's living standards, people pay more and more attention to their own health. Body temperature, as one of the four vital signs parameters, is particularly important for evaluating people's health status. Long-term collection of human body temperature data, on the one hand, can complete early warning of diseases such as fever and fever, and more importantly, in the case of normalized epidemics, real-time collection of body temperature will help timely detection of epidemics. [0003] In order to be convenient to carry, at present, an in-ear earphone is usually used to measure the human body's ear temperature, and a thermistor is arranged at the sound outlet of the earphone near the ear cap to receive the heat radiati...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G01J5/00G01K13/00
CPCG01J5/0011G01K13/00
Inventor 朱方方苏红宏
Owner 嘉兴温芯智能科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products