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Semiconductor device

A semiconductor and virtual technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, transistors, etc., can solve problems such as incompatibilities and increased space

Pending Publication Date: 2021-11-02
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Dummy fins add space and create challenges when scaling down standard cell sizes
While existing dummy fins and their methods of formation are generally suitable for the purpose for which they were developed, they do not meet all requirements

Method used

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  • Semiconductor device
  • Semiconductor device
  • Semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0069] The following detailed description can be accompanied by accompanying drawings to facilitate understanding of various aspects of the present invention. It is worth noting that various structures are used for illustration purposes only and are not drawn to scale, as is the norm in the industry. In fact, the dimensions of the various structures may be arbitrarily increased or decreased for clarity of illustration.

[0070] Different embodiments or examples provided in the following content can implement different structures of the embodiments of the present invention. The examples of specific components and arrangements are used to simplify the disclosure and not to limit the invention. For example, a statement that a first component is formed on a second component includes that the two are in direct contact, or that there are other additional components in between the two instead of direct contact. In addition, various examples of the present invention may repeatedly u...

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PUM

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Abstract

The invention provides a semiconductor device. The semiconductor device includes a first source / drain structure, a second source / drain structure, a third source / drain structure, a first dummy fin, and a second dummy fin. The first dummy fin is located between the first source / drain structure and the second source / drain structure along the direction to isolate the first source / drain structure from the second source / drain structure; the second dummy fin is located between the second source / drain structure and the third source / drain structure in the direction to isolate the second source / drain structure from the third source / drain structure. The first dummy fin includes an outer dielectric layer, an inner dielectric layer on the outer dielectric layer, and a first cap layer on the outer dielectric layer and the inner dielectric layer. The second dummy fin includes a bottom portion and a second cap layer on the bottom portion.

Description

technical field [0001] Embodiments of the present invention relate to source / drain separation structures and fabrication methods thereof, in particular to forming different dummy fins to achieve different spaces between active regions to reduce size or improve performance. Background technique [0002] The semiconductor integrated circuit industry has experienced exponential growth. Technological advances in integrated circuit materials and design have resulted in each generation of integrated circuits having smaller and more complex circuits than the previous generation. In the evolution of integrated circuits, functional density (eg, the number of interconnecting devices per unit chip area) generally increases as geometric size (eg, the smallest component or circuit that can be produced by the fabrication process employed) shrinks. A shrinking process facilitates increased throughput and lower associated costs. Shrinking dimensions also increase the complexity of handlin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/11H10B10/00
CPCH10B10/12H01L29/165H01L29/7848H01L29/66545H01L29/775H01L27/088H01L21/823481H01L21/823418H01L27/092H01L21/823878B82Y10/00H01L29/0673H01L29/66439H01L29/0847H01L29/42392H01L29/78696H10B10/125H01L21/02532H01L21/02603H01L21/823807H01L21/823814H01L29/66742H01L21/02126H01L21/02167H01L21/02178H01L21/02181H01L21/02183H01L21/02186H01L21/02189H01L29/0653H01L29/78618H01L21/764
Inventor 耿文骏徐国修杨智铨洪连嵘王屏薇
Owner TAIWAN SEMICON MFG CO LTD