Oligomer (2,6-dimethylphenylene ether) Together with Fabrication Method and Cured Product Thereof

Abstract

The invention discloses an oligomer (2,6-dimethylphenylene ether) together with a fabrication method and cured product thereof. The oligomer (2,6-dimethylphenylene ether) includes a structure shown shown in the formula (1), wherein R0, R1, R2 and R3 are separately independent hydrogen, C1-C6 alkyl or phenyl; N and m are each independently an integer from 0 to 300; q is an integer from 0 to 1; X and Y are each independently-NR-,-CO-,-SO-,-CS-,-SO2-,-CH2-,-O-, null,-C (CH3) 2-or and Z is hydrogen.

Description

technical field [0001] The present invention relates to an oligomer, its preparation method and cured product, and in particular to an oligomer (2,6-dimethylphenylene ether), its preparation method and its cured product. Background technique [0002] With the advancement of semiconductor technology, the size of electronic components continues to shrink, making the line width of the metal wires in the circuit board thinner and thinner, and the line spacing between the wires is getting smaller and smaller, in order to meet the current needs, but in the metal distribution In the wire manufacturing process, there are two main problems that will affect its performance, one of which is the signal transmission delay (RC delay) caused by the metal wire and the dielectric layer, and the other is the signal interference between the metal wire wiring (cross talk), as can be seen from literature [1], the signal transmission speed will be related to the dielectric constant (dielectric co...

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Problems solved by technology

[0002] With the advancement of semiconductor technology, the size of electronic components continues to shrink, making the line width of the metal wires in the circuit board thinner and thinner, and the line spacing between the wires is getting smaller and smaller, in order to meet the current needs, but in the metal distribution In the wire manufacturing process, there are two main problems that will affect its performance, one of which is the signal transmission delay (RC delay) caused by the metal wire and the dielectric layer, and the other is the signal interference between the metal wire wiring (cross talk), as can be seen from literature [1], the signal transmission speed will be related to the dielectric constant (dielectric constant; D k ) is inversely proportional to the square root, and the dielectric loss (dissipation factor; D f ) is lower, the easier it is to maintain the integrity of the signal, so reducing the dielectric constant and dielectric loss is a necessary trend, so how to prepare materials with excellent electrical properties has become the most important issue at present

[0003] Epoxy resin is a kind of thermosetting material. After reacting with hardener, it can form a three-dimensional network cross-linked structure, so that it has good mechanical properties, chemical resistance, adhesion, good thermal properties and insulation effects. For traditional phenol-type and amine-type hardeners, epoxy resin ring-opening polymerization produces highly polar secondary alcohols, making it difficult to improve the dielectric properties

In 2014, in the patent US 8,791,214 B2 published by DIC, multiple compounds containing phenolic groups such as phenol novolac (PN) and dicyclopentadiene phenol novolac (DCPDPN) were reacted with monofunctional or difunctional acid chlorides to obtain active ester groups. Hardener, and then cured with epoxy resin HP7200, the epoxy resin will undergo transesterification with active ester groups during the ring-opening process, and will not produce highly polar secondary alcohols, which is conducive to reducing the dielectric constant, although Modifying the hydroxyl group of the hardener to an ester group can reduce the dielectric properties, but also because the ester group will replace the hydroxyl group after the ring opening of the epoxy resin after the active ester group reacts with the epoxy resin, thereby reducing the intermolecular hydrogen bond force , so that the glass transition temperature (glass transition temperature; Tg) of the cured product decreases. Therefore, how to maintain the original thermal properties while reducing the dielectric properties is also very important.

[0011] In addition, the flame retardant properties of existing poly(2,6-dimethylphenylene ether) materials can only reach the V-1 level under the UL-94 specification test. To further reach the V-0 level, additional The flame retardant makes it reach the V-0 level. For example, GE Corporation of the United States published a patent US 6,352,782B2. Copolymerize to obtain flame-retardant poly(2,6-dimethylphenylene ether) resin. However, the dielectric constant at 1MHz will soar from 3.86 to 5.07, and the dielectric loss will also soar from 0.0024 to 0.0065. Loss of poly(2,6-dimethylphenylene ether) characteristic of excellent dielectric properties

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