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A packaging device and packaging method for miniled

A technology for packaging equipment and mounting boards, applied in printing devices, printing, screen printing, etc., can solve the problems of solder paste waste and unusable solder paste, and achieve the effect of uniform distribution of solder paste

Active Publication Date: 2022-07-12
SHENZHEN SOUTH POLE OPTOELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned related technologies, the inventor believes that when the scraper scrapes the stencil back and forth, part of the solder paste on the stencil will slide from both sides of the scraper to the edge of the stencil, and the edge of the stencil is out of the way of the scraper. area, so that the solder paste in this area cannot be used, resulting in waste of solder paste

Method used

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  • A packaging device and packaging method for miniled
  • A packaging device and packaging method for miniled
  • A packaging device and packaging method for miniled

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Experimental program
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Embodiment Construction

[0045] The present application will be further described in detail below with reference to the accompanying drawings.

[0046] The embodiment of the present application discloses a packaging device for Mini LED. refer to figure 1 , 2 , the packaging equipment for MiniLED includes a packaging printing machine, and the packaging printing machine includes a frame 1, a steel mesh 2 installed horizontally in the frame 1, and a workbench 3 that slides horizontally under the steel mesh 2. The workbench 3 is installed with a The platform 4 is in a horizontal state, and a lifting cylinder 5 is arranged between the worktable 3 and the platform 4. When the substrate is placed on the platform 4, through the expansion and contraction of the piston rod of the lifting cylinder 5, the substrate on the platform 4 can be attached to the steel plate. The lower end of net 2. Specifically, a rail for the worktable 3 to slide horizontally is provided below the steel mesh 2 , and a transmission b...

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PUM

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Abstract

The present application discloses a packaging device and a packaging method for Mini LED, which relate to the technical field of semiconductor chips and reduce the waste of solder paste. The packaging printing machine includes a frame and is horizontally arranged on the frame. The steel mesh in the middle and the workbench under the steel mesh are arranged with horizontal sliding, and a platform for placing the substrate is installed on the workbench; the frame is located above the steel mesh and is horizontally provided with a guide rail, and a scraper is installed on the guide rail. mechanism and a drive mechanism that drives the scraper mechanism to move along the guide rail. The present application can reduce the waste of solder paste and improve the utilization rate of the solder paste.

Description

technical field [0001] The present application relates to the technical field of semiconductor chips, and in particular, to a packaging device and a packaging method for Mini LEDs. Background technique [0002] MiniLED is a type of LED, which means LED with a grain size of about 100-200 microns. Mini LED packaging refers to the packaging of light-emitting chips, which is generally packaged by an LED packaging printer. [0003] When encapsulating, you need to select the corresponding substrate with several groups of pads; then stick the substrate under the stencil of the packaging printer, and align the pads on the substrate with the holes of the stencil; then place the stencil on the stencil Pour in the solder paste and use a scraper to scrape the stencil back and forth, so that the solder paste falls on the pad through the holes of the stencil; take out the substrate, and place the MiniLED on the pad of the substrate, so that the MiniLED is fixed on the substrate. [0004...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41F15/08B41F15/16B41F15/42B41F15/14H01L33/62
CPCB41F15/08B41F15/16B41F15/42B41F15/14H01L33/62B41P2215/10B41P2217/50
Inventor 李良桐张万洁徐贤强潘连兴
Owner SHENZHEN SOUTH POLE OPTOELECTRONICS TECH