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Adhesive sheet

A technology of adhesive sheets and adhesive surfaces, which is applied in the direction of adhesives, film/sheet adhesives, adhesive heating bonding methods, etc., which can solve the problems of reduced practicability, restrictions on adhesive thickness, and substrates. Or the problem of poor adhesion of the processing table, to achieve the effect of suppressing the generation of cutting chips and excellent cutting accuracy

Pending Publication Date: 2021-11-16
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the adhesive sheet containing thermally expandable microspheres has a problem that the thickness of the adhesive is limited due to the inclusion of thermally expandable microspheres.
More specifically, the PSA sheet containing heat-expandable microspheres has the following problems: when the pressure-sensitive adhesive is thinned, the heat-expandable microspheres protrude from the pressure-sensitive adhesive, and the adhesiveness with the base material or the processing table is poor, and the practicability is remarkable. reduce

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0100] Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited to these Examples. Evaluation methods in Examples are as follows. In addition, in an Example, unless otherwise indicated, "part" and "%" are based on weight.

[0101] (1) Determination of the thickness of the adhesive region and the coating material region in Raman microscopic imaging

[0102] The PSA sheets obtained in Examples 1 to 3, 5, 6, and 12 to 15 were sliced ​​with a microtome to prepare measurement samples. The cross-section of the measurement sample was subjected to spectral analysis based on Raman spectroscopy using alpha300RSA manufactured by WITec Corporation, based on peaks derived from components added only to the coating material region (for example, active energy ray reactive oligomerization in Example 3). 1640cm of object (UV1700B) -1 The peak intensity of the peak) measures the thickness of the covering material area and the adhesive area. Takin...

manufacture example 1

[0147] [Production Example 1] Preparation of Polymer 1

[0148] After adding 100 parts of butyl acrylate, 5 parts of acrylic acid, and 0.2 part of benzoyl peroxide as a polymerization initiator to toluene, it heated and obtained the toluene solution of an acrylic copolymer (polymer 1).

manufacture example 2

[0149] [Production Example 2] Preparation of Polymer 2

[0150] Add 30 parts of 2-ethylhexyl acrylate, 70 parts of ethyl acrylate, 4 parts of 2-hydroxyethyl acrylate, 5 parts of N-phenylmaleimide, and benzene peroxide as a polymerization initiator in toluene After 0.2 parts of formyl, it heated and obtained the toluene solution of an acrylic copolymer (polymer 2).

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PUM

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Abstract

Provided is an adhesive sheet which is able to realize excellent cutting precision and a reduction in cutting debris when cutting microcomponents such as electronic components. This adhesive sheet is provided only on one side with an adhesive surface in which the adhesive strength decreases when heated, with the elastic modulus of the surface on the opposite side of the adhesive surface measured by nanoindentation being at least 1 MPa. In a preferred embodiment, the sheet is provided with an adhesive region having the adhesive surface as one surface thereof and a coating region which abuts the side of the adhesive region opposite the adhesive surface in a cross-sectional view, with the adhesive region including an adhesive and thermally expandable microspheres.

Description

[0001] This application is a divisional application of an application with an application date of March 12, 2014, an application number of 201480016007.0, and an invention name of an adhesive sheet. technical field [0002] The present invention relates to an adhesive sheet. Background technique [0003] In the manufacture of electronic components such as silicon wafers, laminated capacitors, and transparent electrodes, substrates that have a large area and are provided with necessary functions are miniaturized to the target size by dicing. During cutting, an adhesive sheet for fixing the workpiece (substrate) is used to prevent reduction in cutting accuracy due to stress and vibration during processing. The PSA sheet is required to have sufficient adhesive force to the workpiece during processing and to be able to easily peel off the cut workpiece (electronic component) after processing. As such a pressure-sensitive adhesive sheet, a pressure-sensitive adhesive sheet conta...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/25C09J7/30C09J5/06H01L21/683C09J7/20
CPCC09J5/06C09J2203/326H01L21/6836H01L2221/68318H01L2221/68327H01L2221/68381C09J7/20C09J2301/412C09J2301/502
Inventor 平山高正北山和宽
Owner NITTO DENKO CORP
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