CSP lamp bead packaging structure and manufacturing process thereof

Abstract

The invention provides a CSP lamp bead packaging structure and a manufacturing process thereof. A metal base material and an insulating base material are attached, then a preset metal base material pattern is manufactured on the metal base material, then an opening for loading an LED chip is formed in the insulating base material, the LED chip is arranged in the opening, a gap is formed between an electrode of the LED chip and the metal base material, the LED chip, the insulation base material and the metal base material are packaged through a fluorescent glue film, the surface of the bottom of the electrode of the LED chip and the surface of the bottom of the metal base material are exposed, and finally the single CSP lamp bead packaging structure is formed through cutting. The metal layer is arranged on the electrode side of the LED chip at an interval, the metal layer serves as the extension bonding pad of the electrode of the LED chip, the weldable area of the CSP is increased, in addition, no solid crystal welding flux exists, the problem of secondary fusion of the CSP solid crystal welding flux caused by too high temperature of the rear section can be effectively avoided, the temperature limitation of the rear-end product is solved, and the method is suitable for the complex process of multiple reflow soldering.

Description

technical field [0001] The application belongs to the technical field of LED packaging, and in particular relates to a CSP lamp bead packaging structure and a manufacturing process thereof. Background technique [0002] CSP (Chip Scale Package) LED has attracted much attention and favor for its high reliability and small size. Common CSP structures generally have two structures, such as figure 1 Structure 1 shown: includes LED chip 1, fluorescent glue 4; as figure 2 The second structure shown: includes bracket 5 , die-bonding solder, LED chip 1 and fluorescent glue 4 . [0003] figure 1 The obvious disadvantages of the CSP of structure 1 are that the pads are small, the effective welding area of ​​CSP is small, the adhesion is small, and the reliability and production yield of the back-end products are low. figure 2 The effective soldering area of ​​the CSP of structure 2 is relatively large, but it uses die-bonding solder to electrically connect the electrodes of the ...

AI Technical Summary

Problems solved by technology

[0003] figure 1 The obvious disadvantages of the CSP of structure 1 are that the pads are small, the effective welding area of ​​CSP is small, the adhesion is small, and the reliability and production yield of the back-end products are low.

figure 2 The effective soldering area of ​​the CSP of structure 2 is relatively large, but it uses die-bonding solder to electrically connect the electrodes of the LED chip 1 and the bracket 5. The obvious disadvantage is that the process temperature in the latter stage cannot approach or exceed the temperature of the die-bonding solder. Otherwise, there will be a problem of secondary melting of the die-bonding solder

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