Ultrasonic laminated transducer for detecting viscoelastic solid
A viscoelastic, transducer technology, applied in the field of ultrasonic laminated transducers, to achieve the best detection effect and the effect of improving the resolution
Pending Publication Date: 2021-11-23
ZHONGBEI UNIV
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[0016] From the above research results, it can be seen that compared with elastic solids, ultrasonic waves cause greater energy attenuation due to dispersion and viscoelastic properties when propagating in viscoelastic solids, which brings great challenges to ultrasonic detection of viscoelastic solids. challenge
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[0035] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0036] The invention provides an ultrasonic laminated transducer for detecting viscoelastic solids, such as figure 1 As shown, it includes housing 1, insulating material 2, backing 3, piezoelectric wafer 4, matching layer 5, conductive copper sheet 6, ground wire 7, signal wire 8 and cable connector 9, and housing 1 is used to protect the transducer The internal components of the device, the housing 1 is provided with an inner cavity, a matching layer 5 is arranged at the bottom of the inner cavity, and a chip group is arranged above the matching layer 5, and the chip group is composed of four 4MHz piezoelectric chips 4 stacked, and the piezoelectric The wafer 4 mainly realizes the conversion between electric energy and acoustic energy, and the matching layer 5 is used to alleviate the difference in acoustic impedance between the piezoelectri...
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The invention discloses an ultrasonic laminated transducer for detecting viscoelastic solid. The ultrasonic laminated transducer comprises a shell, an insulating material, a backing, piezoelectric wafers, a matching layer, a conductive copper sheet, a ground wire, a signal wire and a cable connector, the shell is provided with an inner cavity, the matching layer is arranged at the bottom of the inner cavity, a wafer group is arranged on the matching layer, the wafer group is formed by stacking four 4MHz piezoelectric wafers, the conductive copper sheet is clamped between every two adjacent piezoelectric crystal plates, the surfaces, with the same polarity, of every two adjacent piezoelectric crystal plates are opposite, and each piezoelectric crystal plate is of a circular solid structure; the backing is arranged on the wafer group, the inner cavity in the backing is filled with theinsulating material, the cable connector is arranged outside the shell, and the cable connector is internally connected with two ends of the electrode of the wafer group through the signal wire and the ground wire respectively. According to the scheme, the high attenuation characteristic of ultrasonic waves during propagation in the viscoelastic solid is made up, and the resolution ratio of ultrasonic detection of the viscoelastic solid is effectively improved.
Description
technical field [0001] The invention belongs to the technical field of viscoelastic solid detection equipment, in particular to an ultrasonic laminated transducer for detecting viscoelastic solids. Background technique [0002] A transducer is a device that converts electrical energy and sound energy into each other. Common ultrasonic transducers convert electrical energy into ultrasonic waves for underwater communication. According to relevant literature at home and abroad, the current piezoelectric chip stacking technology is mainly used in underwater acoustic transducers. Due to the large difference in structure between underwater acoustic transducers and industrial component flaw detection transducers, the underwater acoustic transducer The energy detector is not directly used for flaw detection of industrial components. No related applications were found in Ultrasonic Flaw Detection Transducers. When the underwater transducer is used to detect viscoelastic solids, du...
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Login to View More IPC IPC(8): G01N29/24G01N29/04
CPCG01N29/2437G01N29/043G01N2291/014
Inventor 杨顺民宋文爱陈以方董晓丽张世雄
Owner ZHONGBEI UNIV