An electronic chip packaging device with a protective structure

Abstract

The invention discloses an electronic chip packaging device with a protective structure, which comprises a workbench, a placement box and a fixing sleeve. Sleeve; several support sleeves are arranged around the inner wall of the storage box, and the inside of the support sleeve is slidably connected with a transmission rod; the inside of the support sleeve is provided with a shock absorbing spring, and the shock absorber The top end of the spring is connected to the bottom end of the transmission rod. In the present invention, through the setting of the support sleeve, the fixed horizontal plate and the movable sleeve, the shock-absorbing spring can offset the external force on the electronic chip according to its own elasticity, thereby providing a better protection effect, so that the structure has a better In addition, the combination of the fixed horizontal plate, the limit chute, the movable plate, the movable sleeve and the return spring makes the structure have a better self-adaptive function, thereby improving the working speed of the staff, and then improving novelty.

Description

technical field [0001] The invention relates to the technical field of electronic chips, in particular to an electronic chip packaging device with a protective structure. Background technique [0002] With the support and promotion of relevant policies, my country's electronic chip industry has made great progress, both in terms of product technology and overall strength. However, facing the complex production process of chips and the design of advanced chips, In terms of processing capacity and other aspects, my country's chip industry still lags behind advanced countries. [0003] The defective that existing a kind of electronic chip packaging equipment exists is: [0004] 1. The comparative document CN113035754A discloses an electronic packaging device for semiconductor chips and a production method thereof, "including a transportation mechanism, a loading mechanism and a packaging mechanism; the loading mechanism is located at the rear of the transportation mechanism, an...

AI Technical Summary

Problems solved by technology

In this easy-to-adjust chip packaging equipment, start the motor to rotate forward, make the first gear rotate clockwise, and drive the second gear to rotate counterclockwise, thereby driving the adjustment block to rotate counterclockwise, causing the first screw to move downward, thereby driving the packaging machine to Down adjustment; in the same way, start the motor in reverse, the packaging machine can be adjusted upwards, and the packaging machine can be adjusted up and down just by starting the motor, so that the packaging equipment can be adjusted according to different chips and improve work efficiency. "However, this equipment It does not have a good precision adjustment structure. During spot welding, if the position is shifted, it will easily affect the normal use of the electronic chip, and then affect its normal operation;

[0006] 3. The comparative document CN112397435A discloses a heat-dissipating chip packaging device, "including a connecting pipe and a suction nozzle, the connecting pipe is arranged vertically, the top of the suction nozzle is provided with a mounting groove, and the suction nozzle is installed through the mounting groove At the bottom end of the connecting pipe, the bottom of the suction nozzle is provided with an air hole, the air hole is coaxially arranged with the connecting pipe and communicated with the bottom end of the connecting pipe, the aperture of the air hole is smaller than the inner diameter of the connecting pipe, and the connecting pipe There is a cleaning mechanism and a heat dissipation mechanism on it. The cleaning mechanism includes an actuator assembly and two locking assemblies. The actuator assembly includes a magnet block, an electromagnet, a support block, a push rod, a first spring, and a squeeze plate. The locking assembly includes locking blocks, positioning rods, locking rods, screw rods, sliders, rotating shafts, bearings, racks, gears and through holes. function, not only that, but also improves the heat dissipation effect of the suction nozzle through the heat dissipation mechanism", but this equipment does not have a good heat dissipation structure. If the heat generated by the electronic chip is not dissipated in time, it is easy to cause damage to the electronic chip, and then shorten its useful life;

The chip packaging equipment described in this utility model can prevent chip failure or short circuit caused by the influence of moisture in the air in the unpressed gap inside, so that the quality of chip packaging can be improved, and the flue gas can be purified. , to prevent harmful fumes from processing from endangering human health", but the equipment does not have a good spot welding preview structure, which makes it difficult for the staff to determine the spot welding position when performing spot welding work, which easily affects the quality of work

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