Modified liquid metal composite material capable of being directly formed and preparation method thereof

A technology of liquid metal and composite materials, applied in the direction of replication/marking methods, heat exchange materials, chemical instruments and methods, etc., can solve the problem of the mismatch of interfacial tension between liquid metal and polymer matrix, the difficulty of direct forming of liquid metal, and the hindrance of liquid state Metal application and other problems, to achieve the effect of fluidity, good plasticity and low tension

Active Publication Date: 2021-11-30
SICHUAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the high surface tension (>550 m N / m) of liquid metal greatly increases the complexity of its processing and application, especially in lamination, patterning and printing.
For example, without complicated chemical modifications, it is very difficult to compound liquid metals and ensure uniform dispersion due to the mismatch of interfacial tension between liquid metal and polymer matrix.
In addition, for special forming methods, such as inkjet printing, microelectronic printing or 3D printing technology, due to the high surface tension of liquid metal, it will be decomposed into discontinuous droplets when it is extruded from the needle tube, making these Technology is difficult to realize, which hinders the application of liquid metal in the field of flexible electronics as stretchable 2D / 3D materials such as wires, electrodes and antennas
[0004] It can be seen that liquid metal is difficult to form directly, that is, it is still impossible to control the shape and mechanical properties of liquid metal with current technical means.

Method used

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  • Modified liquid metal composite material capable of being directly formed and preparation method thereof
  • Modified liquid metal composite material capable of being directly formed and preparation method thereof
  • Modified liquid metal composite material capable of being directly formed and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Embodiment 1: putty state liquid metal-aluminum nitride (0.4972m 2 / g) Preparation of (LM-AlN) liquid metal matrix composites and its application in thermally conductive materials:

[0034]Add 15g of aluminum nitride and 24g of gallium indium tin liquid metal into a mortar, grind for 20 minutes and mix well to obtain a putty-like mixture. In order to disperse the aluminum nitride more uniformly in the liquid metal matrix, the mixture is then transferred to a mixer, and mixed to obtain a putty-like LM-AlN liquid metal matrix composite. The thermal conductivity of the obtained composite is 52.16 W / m K.

Embodiment 2

[0035] Embodiment 2: putty state liquid metal-alumina (0.7726m 2 / g)(LM-Al 2 o 3 ) Preparation of liquid metal matrix composites and their application in thermally conductive materials:

[0036] Add 14g of alumina and 20g of gallium indium tin liquid metal into a mortar, grind for 20 minutes and mix well to obtain a putty-like mixture. In order to disperse aluminum oxide more uniformly in the liquid metal matrix, transfer the mixture to a mixer and mix to obtain putty-like LM-Al 2 o 3 Liquid metal matrix composites. The thermal conductivity of the obtained composite is 17.74 W / m K.

Embodiment 3

[0037] Embodiment 3: putty state liquid metal-silicon nitride (1.7717m 2 / g)(LM-Si 3 N 4 ) Preparation of liquid metal matrix composites and their application in thermally conductive materials:

[0038] Add 12g of silicon nitride and 20g of gallium indium liquid metal into a mortar, grind for 20 minutes and mix well to obtain a putty-like mixture. In order to disperse the aluminum nitride in the liquid metal matrix more uniformly, the mixture is then transferred to a mixer, and mixed to obtain a putty-like LM-TiN liquid metal matrix composite.

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Abstract

The invention belongs to the field of functional materials, and relates to a preparation method of a modified liquid metal composite material. The invention provides the modified liquid metal composite material which is prepared by compounding a liquid metal and an inorganic material, that is, the inorganic material and the liquid metal are subjected to a mechanical grinding processing method, and through mechanical shear induced mechanochemical action, empty orbits in the liquid metal and lone pair electrons existing on the surface of the inorganic material can form a coordination effect, and metal atoms in the liquid metal enter crystal lattices of the inorganic material; the inorganic material can be uniformly dispersed in the liquid metal due to strong interaction so that the modified liquid metal composite material is obtained; the inorganic filler is an inorganic material containing lone electron pairs, and the specific surface area of the inorganic filler is less than or equal to 18.1142 m < 2 >/g. According to the invention, the putty-shaped or liquid-shaped modified liquid metal composite material can be obtained; the obtained modified liquid metal composite material has excellent plasticity and can be directly formed.

Description

technical field [0001] The invention belongs to the field of preparation of functional composite materials, and in particular relates to a preparation method of a modified liquid metal composite material. Background technique [0002] Liquid metals are a class of materials that have both liquid fluidity and metal functionality at room temperature. In recent years, with the progress of society and the development of science and technology, they have attracted extensive attention from researchers. At present, the common liquid metals mainly include: mercury, rubidium, gallium and gallium-based alloys. Among them, the traditional liquid metal mercury has limited its application in many fields due to its high biological toxicity. As a new generation of functional materials, gallium-based liquid metals have many excellent properties, such as high intrinsic conductivity (4×10 6 S / m), high intrinsic thermal conductivity (26W / m·K), low melting point, low viscosity (2mPa·s) and low...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/14B41M1/12B41M5/00
CPCC09K5/14B41M1/12B41M5/0023
Inventor 吴凯吴蝶刘丁侥傅强陈枫张琴
Owner SICHUAN UNIV
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