Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Semiconductor packaging device

A packaging device and semiconductor technology, which is applied in the manufacture of semiconductor/solid-state devices, devices for coating liquid on the surface, electrical components, etc., can solve the problems of slow cooling speed of semiconductors, reduced sealing of semiconductors, and different sizes of semiconductors, etc., to achieve The effect of increasing the dispensing range, avoiding height reduction, and increasing the rate of packaging

Active Publication Date: 2021-11-30
天霖(张家港)电子科技有限公司
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the deficiencies of the prior art, the present invention provides a semiconductor packaging device, which solves the problem that when the packaging gaps of semiconductors are different in size during packaging, the gaps still appear after packaging, which reduces the sealing performance of semiconductors during storage, and at the same time the sealing of semiconductors after packaging The cooling rate of the semiconductor is slow, and it is easy to cause the problem of adhesion to other parts and damage the semiconductor during storage.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor packaging device
  • Semiconductor packaging device
  • Semiconductor packaging device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] see Figure 1-6 , the present invention provides a technical solution: a semiconductor packaging device, including a device body 1, a processing frame 3 is fixedly connected to the top of the device body 1, and a feeding frame 2 is fixedly connected to the middle position of the bottom of the inner cavity of the processing frame 3. Driven by the power parts, the frame 2 transports the semiconductor to the encapsulation dispensing position for encapsulation, which effectively improves the rate of encapsulation and avoids the deviation of the dispensing position caused by the offset of placement, and the bottom of the inner cavity of the processing frame 3 is fixed The packaging device 4 is connected, the front bottom of the packaging device 4 penetrates the feeding rack 2 and extends to the outside of the feeding rack 2, the front top of the processing frame 3 is fixedly connected to the control panel 6, and the front and bottom sides of the processing frame 3 are fixedly...

Embodiment 2

[0050] see Figure 1-6, on the basis of Embodiment 1, the present invention provides a technical solution: a method for using a semiconductor packaging device, step 1: install and fix the equipment, and fix the equipment main body 1 with the processing frame 3, and feed the The frame 2 is fixedly connected to the packaging device 4, and the equipment main body 1 is connected to the energy source, and the detection light curtain 5 is fixedly connected to the processing frame 3;

[0051] Step 2: Use the dispensing cavity produced by the glue dispenser 43 and the packaging fixture 41 to apply glue at fixed points, and when the semiconductor is fixed, it is in the center position, and the guide device 44 is fixedly connected to the carrier plate 42, and the carrier plate 42 is fixed. It is fixedly connected with the packaging fixture 41, so that the semiconductor is fixed to the dispenser 43;

[0052] Step 3: use the cold air blown by the cooling plate 444 to contact the dispensi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a semiconductor packaging device, which comprises an equipment main body, wherein the top of the equipment main body is fixedly connected with a processing frame, the middle position of the bottom of the inner cavity of the processing frame is fixedly connected with a feeding frame, the bottom of the front surface of the packaging device penetrates through the feeding frame and extends to the outside of the feeding frame, a control panel is fixedly connected to the top of the front surface of the processing frame, and detection light curtains are fixedly connected to the two sides of the bottom of the front surface of the processing frame. The invention relates to the technical field of semiconductors. According to the semiconductor packaging device, the packaging speed is effectively increased; the glue dispensing machine rotates clockwise or anticlockwise on the adjusting device in a reciprocating mode, so that the glue dispensing position is deflected, and the glue dispensing range of the fixed position of a semiconductor is effectively enlarged; and the transmission piece can drive the adjusting device to adjust the glue dispensing machine, so that it is conveniently guaranteed that the proper glue dripping height is kept between the glue dispensing machine and the semiconductor, and the height between the glue dispensing machine and the semiconductor is advantageously prevented from being reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a semiconductor packaging device. Background technique [0002] Semiconductor packaging refers to the process of processing the tested wafers according to the product model and functional requirements to obtain independent chips. The packaging process is: the wafer from the wafer front-end process is cut into small chips (Die) after the dicing process, and then the cut chip is glued to the island of the corresponding substrate (lead frame) frame Then use ultra-fine metal (gold-tin-copper-aluminum) wires or conductive resin to connect the bonding pads (Bond Pad) of the chip to the corresponding pins (Lead) of the substrate to form the required circuit. [0003] According to a semiconductor packaging device disclosed in Chinese Patent No. CN112289717A, the rotation of the first transmission motor drives the first helical gear connected to it to rotate, the rotation...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/67B05C5/02B05C11/10B05C9/14B05C13/02B05D3/00
CPCH01L21/67121H01L21/6715B05C5/0212B05C11/1018B05C11/10B05C9/14B05C13/02B05D3/007
Inventor 吴昌昊黄怡琳田晨阳田英干
Owner 天霖(张家港)电子科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com