Surface acoustic wave temperature sensor, high-temperature-resistant packaging structure and packaging method
A temperature sensor, surface acoustic wave technology, applied in thermometers, thermometer parts, thermometers with physical/chemical changes, etc., can solve problems such as unstructured packaging design work, achieve high reliability, save packaging costs, low cost cost effect
Active Publication Date: 2021-12-03
SHANGHAI JIAO TONG UNIV
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At the same time, no specific work has been done on the structural packaging design in the mentioned high temperature environment
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[0034] The present invention will be described in detail below in conjunction with specific embodiments. The following examples will help those skilled in the art to further understand the present invention, but do not limit the present invention in any form. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention. These all belong to the protection scope of the present invention.
[0035] refer to figure 1 As shown, in one embodiment of the present invention, a high-temperature-resistant packaging structure of a surface acoustic wave temperature sensor is provided. In the figure, 1 is a high-temperature-resistant ceramic packaging structure cover; 2 is a sensor base; 3 is an insulating isolation layer; 4 11 is the transition material layer; 5 is the upper electrode of the embedded electrode layer; 8 is the lower electrode of the embedded electrode layer; 7 is the connecting ...
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The invention provides a surface acoustic wave temperature sensor, a high-temperature-resistant packaging structure and a packaging method. The surface acoustic wave temperature sensor comprises a high-temperature-resistant ceramic packaging structure cover, a transition material layer, an insulation isolation layer and a ceramic packaging structure base. The high-temperature-resistant ceramic packaging structure cover has a certain height and is bonded on the ceramic packaging structure base through high-temperature glue. And the insulation isolation layer and the transition material layer grow on the upper surface of the ceramic packaging structure base. The embedded electrode layer is of a double-layer structure, and an upper-layer electrode and a lower-layer electrode are embedded in the upper surface of the sensor substrate through a process method. And the metalized planar antenna adopts an integrated design and grows on the upper surface of the insulating isolation layer. According to the packaging structure design provided by the invention, normal work of the surface acoustic wave temperature sensor in a 700 DEG C high-temperature environment can be realized.
Description
technical field [0001] The invention relates to the technical field of sensor packaging, in particular to a surface acoustic wave temperature sensor, a high temperature resistant packaging structure and a packaging method. Background technique [0002] High temperature sensors have broad application requirements in aerospace, aviation, national defense construction, energy development and other fields. For example, the main components of power equipment such as rocket engines and aero engines in the aerospace field, heavy-duty gas turbines, and coal-fired gas boilers in the field of large ships are in high-temperature and harsh environments, and the temperature of the combustion chamber even exceeds 1500 ° C. Using high-temperature sensors Real-time monitoring of pressure, temperature and other parameters of key parts such as nozzle combustor, compressor, blade, etc. can improve combustion performance and propulsion efficiency, and evaluate the health status of components. ...
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IPC IPC(8): G01K11/26G01K1/08G01K1/14
CPCG01K11/265G01K1/08G01K1/14
Inventor 吉小军马晓鑫高孜航
Owner SHANGHAI JIAO TONG UNIV