Testing apparatus
A test device and test technology, applied in the direction of measurement device, electromagnetic device manufacturing/processing, semiconductor/solid-state device testing/measurement, etc., can solve problems such as data destruction
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Embodiment approach
[0041] Hereinafter, the present disclosure will be described based on preferred embodiments with reference to the drawings. The same or equivalent constituents, members, and processes shown in the drawings are given the same symbols, and overlapping descriptions are appropriately omitted. Furthermore, the embodiments are not limited to the disclosure but are examples, and all the features and combinations described in the embodiments are not necessarily the disclosed substantive features and combinations.
Embodiment approach 1
[0043] figure 1 is a diagram showing the wafer 10 to be tested. A plurality of devices under test 12 are formed on the wafer under test 10 , and chips of the devices under test 12 are obtained by dicing. In this embodiment, the device under test 12 is an MRAM, and has an MTJ constituting a single MRAM, its peripheral circuits, and a plurality of pins (electrodes) for contact. A dotted line 14 indicates a range (referred to as a co-measurement area) that can be measured simultaneously by the test apparatus 100E described later. Usually, the test apparatus 100E simultaneously measures a plurality of (for example, 256, 128, etc.) devices 12 under test.
[0044] figure 2 It is a block diagram of the test apparatus 100E of Embodiment 1. The test device 100E is for figure 1 A wafer inspection device for testing the tested wafer 10 . The test device 100E includes a tester main body 110 , a test head 120 , a stage 130 , a magnetic field application device 140 , a wafer connectio...
Embodiment approach 2
[0059] Figure 5 It is a figure which shows the test apparatus 100 of Embodiment 2. The test device 100 can measure the external magnetic field B generated by the magnetic field applying device 140 in the diagnostic process. EX . The testing device 100 is used together with the diagnostic wafer 170 and the diagnostic probe card 180 for diagnosis and calibration of the magnetic field applying device 140 .
[0060] Figure 6 is a diagram showing a diagnostic wafer 170 . The diagnostic wafer 170 is placed on the stage 130 in place of the test wafer 10 in the diagnostic process of the testing apparatus 100 . The magnetic field B generated by the magnetic field applying device 140 is formed on the diagnostic wafer 170 . EX A plurality of magnetic detection units 172. exist Figure 6 , the co-measurement area 14 is indicated by a dotted line. The same measurement area 14 can be said to ensure a uniform external magnetic field B EX the range of application. The material of ...
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