A rapid initial positioning device for a lead frame cutting die
An initial positioning and lead frame technology, which is applied in the field of rapid initial positioning device for lead frame cutting molds, can solve the problems of poor mold adaptability, inaccurate positioning, and unguaranteed qualified rate of finished products, so as to ensure smooth feeding and reduce electromagnetic damping effect of influence
Active Publication Date: 2022-04-12
NINGBO DEZHOU PRECISION ELECTRONIC CO LTD
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Problems solved by technology
[0003] At present, when the lead frame needs to be cut and bent at the same time, stamping equipment and traditional progressive dies are used. During the rapid feeding process of the lead frame, it stops again after being transported, and its own inertia will make it Sliding a small amount of displacement leads to inaccurate positioning, which affects the subsequent bending and cutting process, and the qualified rate of finished products cannot be guaranteed; and the mold has poor adaptability and cannot match lead frames of various lengths
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[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.
[0033] In describing the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", " The orientation or positional relationship indicated by "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, so as to Specific orientation configurations and operations, therefore, are not to be construed as limitations on the invention.
[0034] refer to Figure ...
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The invention discloses a fast initial positioning device for a lead frame cutting mold, which comprises a mold body, and the mold body includes an upper mold base and a lower mold base, a mounting frame is fixedly arranged on the side wall of the lower mold base, and the mounting frame Rotation is connected with a rotating shaft, and the rotating shaft is provided with a continuously variable speed roller assembly, and a gear assembly is provided on one side wall of the upper die base, which drives the rotating shaft to rotate during the lowering process of the upper die base, and is located at the feeder of the mold body. The lower mold base at the end is also provided with a deceleration assembly, and a transition roller is rotatably connected to the side wall of the feed end of the lower mold base. A centrifugal drive assembly is provided for starting the work of the deceleration assembly. The invention relates to the technical field of auxiliary equipment for lead frame processing. The rapid initial positioning device for a lead frame cutting die can perform double rapid positioning during its feeding process, thereby effectively ensuring the pass rate of lead frame finished products.
Description
technical field [0001] The invention relates to the technical field of lead frame processing auxiliary equipment, in particular to a rapid initial positioning device for a lead frame cutting die. Background technique [0002] As the chip carrier of integrated circuits, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the outer lead by means of bonding materials (gold wire, aluminum wire, copper wire) to form an electrical circuit. When it comes to the bridge function of connecting with external wires, most semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. [0003] At present, when the lead frame needs to be cut and bent at the same time, stamping equipment and traditional progressive dies are used. During the rapid feeding process of the lead frame, it stops again after being transported, and its own ine...
Claims
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IPC IPC(8): B21D37/10B21D43/00B21D28/14
CPCB21D37/10B21D43/003B21D28/14
Inventor 冯军民王李发李勇俞世友赵清
Owner NINGBO DEZHOU PRECISION ELECTRONIC CO LTD