Solder resist resin composition, solder resist structure, dry film and printed wiring board

A technology of resin composition and structure, applied in printed circuit, printed circuit manufacturing, printed circuit parts, etc., can solve the problems of high cost and complicated OLED display manufacturing process, and achieve the effect of excellent dispersion

Pending Publication Date: 2021-12-10
TAIYO INK MFG CO KOREALTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This new type of material called solvent-resistant resins (SR) was developed for use with electronic devices such as displays that require good heat dissipation during operation. These materials have very stable properties over time but they also allow them to stick together well even if there are small gaps between components or other factors affecting their performance. When used on an LCD screen, this SR helps improve its efficiency by allowing it better to direct emitted lights towards certain areas while still being able to absorb some amount of incident radiation.

Problems solved by technology

The technical problem addressed in this patents relates to improving reflection performance without causing cracks caused by stress factors like thermal shock or humidity while still allowing sufficient flexibility in terms of design changes. Additionally, the current methods require expensive materials and involve complex steps making them difficult to control over quality consistency across different products.

Method used

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  • Solder resist resin composition, solder resist structure, dry film and printed wiring board
  • Solder resist resin composition, solder resist structure, dry film and printed wiring board
  • Solder resist resin composition, solder resist structure, dry film and printed wiring board

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[0082] The solder resist resin composition of the present invention may contain an organic solvent for the purpose of preparation of the composition, viscosity adjustment at the time of coating on a substrate or a carrier film, and the like. As the organic solvent, known and commonly used organic solvents can be used, such as esters; aliphatic hydrocarbons such as octane and decane; petroleum solvents such as petroleum ether, petroleum naphtha, and solvent naphtha. These organic solvents can be used individually or in combination of 2 or more types.

[0083] The solder resist resin composition of the present invention may contain an antioxidant. Usually, since an antioxidant is included to prevent oxidative deterioration of curable resins, etc., it has the effect of suppressing discoloration and the effect of improving heat resistance and resolution (line width reproducibility). That is, depending on the type of white colorant, the resolution may be deteriorated by reflecting...

Embodiment

[0104] Hereinafter, the present invention will be described in detail using examples.

[0105] Preparation of Fluorescent Particles Containing Phosphors and Colorants

[0106] Prepared phosphor 1,4-bis(2-benzoxazolyl)naphthalene with 90-92 mass percent, 4,4'-bis[2-(2-methoxyphenyl) with 7-8 mass percent ) PhosphorBlue440, a particle-form phosphor mixture of vinyl]-1,1'-biphenyl.

[0107] Phosphor Blue OEF-BTS, the fluorescent particle, was prepared by coating the phosphor mixture PhosphorBlue440 with the colorant 1,4-bis(butylamino)anthracene-9,10-dione. The mass ratio of the above-mentioned phosphor mixture Phosphor Blue440 to the colorant coated with it is 100:0.2.

[0108] Size of Phosphors and Phosphor Particles

[0109]The size or diameter of the phosphor (Phosphor Blue440) and fluorescent particles (Phosphor Blue OEF-BTS) can be measured using a particle size analyzer, a grinder, or the like. The size measurement result of the above phosphor Phosphor Blue440 was 5 μm...

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Abstract

The present invention relates to a resin composition having excellent dispersity, settling stability, and agglomeration stability. In addition, the present invention relates to a solder resist structure, a dry film, and a printed wiring board, which are formed from the resin composition and exhibit high average reflectance and reflectance at a wavelength of 450 nm before and after a reflow process without requiring a reflective plate. The resin composition is characterized in that a photosensitive resin composition and a thermosetting resin composition contain (B) rutile titanium oxide, (C) a phosphor and (D) a colorant, and the (C) phosphor is coated with the (D) colorant.

Description

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Claims

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Application Information

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Owner TAIYO INK MFG CO KOREALTD
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