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Module chip packaging structure and circuit board

A chip packaging structure and module technology, applied in the direction of electrical components, impedance networks, etc., can solve the problems of small bump duty ratio, bump cracks, reliability failure, etc. of non-filter components

Active Publication Date: 2021-12-14
MAXSCEND MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing technology is that there are cavities at the bottom of all the chips in the module, and some non-filter components have local cracks in the bumps after reliability tests such as cold and heat shock due to the small duty cycle of the bumps. There is a risk of reliability failure

Method used

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  • Module chip packaging structure and circuit board
  • Module chip packaging structure and circuit board
  • Module chip packaging structure and circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Such as Figure 1-2 As shown, the present embodiment provides a module chip packaging structure, which includes a substrate 1 , a filter chip 2 , a non-filter function chip 3 , an isolation layer 4 and a molding compound 5 . Wherein, the filter chip 2 includes a first chip body 21 and a plurality of first bumps 22 arranged on the first chip body 21, and the plurality of first bumps 22 are all connected to the substrate 1, and between the first chip body 21 and the substrate 1 A first cavity is formed; the non-filtering function chip 3 includes a second chip body 31 and a plurality of second bumps 32 arranged on the second chip body 31, and a plurality of second bumps 32 are connected to the substrate 1, and the second chip body A second cavity is formed between 31 and the substrate 1 . The isolation layer 4 covers the filter chip 2 and the non-filter function chip 3 and lays on the substrate 1; the plastic encapsulant 5 encapsulates the filter chip 2 on the substrate 1...

Embodiment 2

[0061] This embodiment also provides a circuit board, including the module chip packaging structure in the above solution.

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Abstract

The invention relates to the technical field of chip packaging, and particularly discloses a module chip packaging structure and a circuit board. In the module chip packaging structure, a filter chip is connected with a substrate through a first salient point, and a first cavity is formed between a first chip body and the substrate; a non-filtering functional chip is connected with the substrate through a second salient point; a second cavity is formed between a second chip body and the substrate; an isolation layer covers the filter chip and the non-filtering functional chip and is laid on the substrate; a plastic package material packages the filter chip on the substrate and is located at one side, far away from the filter chip, of the isolation layer; and the plastic package material packages the non-filtering functional chip on the substrate, is located on one side, far away from the non-filtering functional chip, of the isolation layer, and can penetrate through the isolation layer to be filled in the second cavity. According to the arrangement, in the plastic packaging process, the plastic packaging material can penetrate through the isolation layer to be filled in the second cavity, protection is provided for the second salient point of the non-filtering functional chip, and the reliability of the module is improved.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a module chip packaging structure and a circuit board. Background technique [0002] The working principle of the SAW filter is that sound waves are transmitted on the surface of the chip. Therefore, the packaging of the SAW filter must ensure that the surface of the IDT cannot contact other substances, that is, it must be ensured that the chip surface is a cavity structure. Otherwise, signal transmission will be affected. The components of RF module products based on SAW filters include antenna switches, low-noise amplifiers, capacitors, inductors and other conventional components that can work without cavities. [0003] The existing technology is that there are cavities at the bottom of all chips in the module, and some non-filter components have local cracks in the bumps after reliability tests such as thermal shock due to the small duty cycle of the bumps. There is a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H9/05H03H9/10H03H9/64
CPCH03H9/058H03H9/1064H03H9/64
Inventor 王鑫宋驭超王亮
Owner MAXSCEND MICROELECTRONICS CO LTD