Integrated floatable AI server liquid cooling assembly

Abstract

The invention relates to an integrated floatable AI server liquid cooling assembly which comprises a metal plate wrench and at least two water cooling plates which are assembled at the bottom of the metal plate wrench in a floating mode and distributed at intervals, and each water cooling plate is provided with a screw used for being connected with a PCB mainboard. According to the invention, a top metal plate is in floating connection with the plurality of water cooling plates at the bottom, so that when each water cooling plate is mounted to a server chip module, the height of each water cooling plate relative to a horizontal plane can be adjusted through a spring floatable sleeve connecting mechanism without mutual influence and restriction, thereby ensuring good attachment of each water cooling plate and a chip, the installation and heat dissipation effects are not affected by the height difference generated by the chips when the chips are installed on the PCB main board, so that efficient liquid cooling heat dissipation of the multiple AI chips laid on the PCB can be achieved, and simple and convenient operation and maintenance operation by one person can be achieved.

Description

technical field [0001] The invention belongs to the technical field of liquid cooling and heat dissipation, and in particular relates to an integrated floating AI server liquid cooling assembly. Background technique [0002] With the development of technologies such as 5G and the Internet of Things, large-scale deployment of high-performance computing data centers is required. At present, the heat dissipation solution for servers in the data center industry is mainly air-cooled. With the continuous increase in chip thermal power consumption, especially the high heat flux density of AI server chips, it is difficult for air-cooled heat dissipation solutions to meet their heat dissipation needs. Liquid-cooled heat dissipation Solution Due to its efficient heat dissipation performance, the application of liquid cooling heat dissipation technology in AI servers is imminent. [0003] One of the existing solutions in the industry is a relatively mature air-cooled heat dissipation ...

AI Technical Summary

Problems solved by technology

At present, the heat dissipation solution for servers in the data center industry is mainly air-cooled. With the continuous increase in chip thermal power consumption, especially the high heat flux density of AI server chips, it is difficult for air-cooled heat dissipation solutions to meet their heat dissipation needs. Liquid-cooled heat dissipation Solution Due to its efficient heat dissipation performance, the application of liquid cooling technology in AI servers is imminent

[0003] One of the existing solutions in the industry is a relatively mature air-cooled heat dissipation solution. In order to improve the heat dissipation performance, the radiator is large in size, which has disadvantages such as large volume, heavy weight, limited heat dissipation capacity, and loud noise.

The other is the split liquid cooling solution in the sample stage. The installation and disassembly process is complicated and requires the cooperation of multiple people. It is extremely difficult to operate and maintain, and the labor cost is huge.

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