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High-precision multi-layer through hole plate with special blind holes

A multi-layer through-hole, high-precision technology, used in cooling/ventilation/heating transformation, modification with gaseous coolant, electrical components, etc. Inconvenient installation and disassembly, to achieve the effect of increasing the cooling effect, reducing safety accidents, and reducing the space occupied

Inactive Publication Date: 2021-12-21
江西弘高科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the insufficient heat dissipation performance of the existing multi-layer through-hole board, it will cause damage to the PCB board and electronic components, and it is prone to safety accidents. At the same time, due to the small size of the multi-layer through-hole board, it is not convenient for the staff to install and disassemble. , the technical problem is: to provide a high-precision multi-layer through-hole plate with special blind holes with good protection effect, easy installation and disassembly, and good heat dissipation effect

Method used

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  • High-precision multi-layer through hole plate with special blind holes
  • High-precision multi-layer through hole plate with special blind holes
  • High-precision multi-layer through hole plate with special blind holes

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Embodiment 1

[0046] A high-precision multi-layer through-hole board with special blind holes, such as Figure 1-24 As shown, it includes a connection block 1, a frame body 2, a filter screen 4, a PCB board 5, a first sliding sleeve 6, a conductive block 7, an electric wire 8, a mounting mechanism 9 and a limit mechanism 10, and the bottom of the frame body 2 is symmetrically arranged There is a connection block 1, a filter screen 4 is arranged on the upper part of the frame body 2, a PCB board 5 is arranged on the inner side of the frame body 2, a first sliding sleeve 6 is arranged symmetrically on the left and right sides of the inner bottom of the frame body 2, and a sliding type is arranged between the first sliding sleeves 6. There is a conductive block 7, two wires 8 are connected between the left and right sides of the conductive block 7 and the bottom of the PCB board 5, the connecting block 1 is in contact with the conductive block 7, and the rear side of the frame body 2 is provide...

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Abstract

The invention relates to a multi-layer through hole plate, in particular to a high-precision multi-layer through hole plate with special blind holes. The technical problem is to provide the high-precision multi-layer through hole plate with the special blind holes which is good in protection effect, convenient to mount and dismount and good in heat dissipation effect. The high-precision multi-layer through hole plate with the special blind holes is characterized by comprising connecting blocks, a frame body, a filter screen, a PCB, first sliding sleeves, a conductive block, electric wires, a mounting mechanism and a limiting mechanism,wherein the connecting blocks are symmetrically arranged at the bottom part of the frame body, the filter screen is arranged on the frame body, the PCB is arranged on the inner side of the frame body, the first sliding sleeves are symmetrically arranged at the bottom in the frame body, a conductive block is arranged between the first sliding sleeves in a sliding mode, the two electric wires are connected between the two sides of the conductive block and the bottom part of the PCB, the connecting blocks make contact with the conductive block, the mounting mechanism is arranged on one side of the frame body, and the limiting mechanism is arranged in the frame body. An output shaft of a first gear motor drives a screw rod to rotate and further drives a threaded sleeve and a pull rod to move downwards, the pull rod is retracted, and occupied space is reduced.

Description

technical field [0001] The invention relates to a multilayer through-hole plate, in particular to a high-precision multilayer through-hole plate with special blind holes. Background technique [0002] Nowadays, because the PCB board will be installed with a large number of electronic components, the electronic components will generate a lot of heat with the work of the PCB board. very high. However, the heat dissipation performance of the existing multi-layer through-hole board is insufficient. After a long time of use, the accumulated heat of the electronic components cannot be dissipated and the temperature rises, which will cause damage to the PCB board and the electronic components, resulting in a decrease in the performance of the PCB board or even loss. Layer phenomenon, and safety accidents are prone to occur. At the same time, due to the small size of the multi-layer through-hole plate, the operation is more complicated when installing and dismounting the multi-laye...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20136H05K7/20209H05K7/20318
Inventor 李顺祥梁继涛
Owner 江西弘高科技有限公司