Thin-wall case preparation method

Abstract

The invention provides a thin-wall case preparation method. The thin-wall case preparation method comprises the steps of processing a blank into a thin-wall prefabricated part corresponding to a thin-wall case; carrying out roughening treatment on the surface of the thin-wall prefabricated part to form a rough thin-wall part; laying a single layer of prepreg on the surface of the rough thin-wall part to form a thin-wall assembly; and carrying out curing forming on the thin-wall assembly so as to prepare the thin-wall case. The thin-wall case preparation method is suitable for manufacturing the thin-wall case special for electronic equipment, the single layer of prepreg is laid on the surface of the rough thin-wall part, the prepreg and a metal layer can have good interlayer connection performance, the problems of interlayer wrinkles, glue shortness, glue excess and the like can be avoided, a processing mold is not needed, and the manufacturing cost is reduced.

Description

technical field [0001] The present disclosure relates to the technical field of thin-walled structures, and more particularly relates to a preparation method of a thin-walled cabinet. Background technique [0002] With the acceleration of modern national defense construction, a series of new high requirements and high standards have been put forward for miniaturization, light weight, and integration of electronic equipment chassis on aircraft, ships, and missiles. A large number of low-density, high-strength, high-performance advanced composite material technologies such as carbon fiber and aramid fiber have been widely used in electronic equipment chassis. [0003] Since electronic equipment cases require a large number of screws, the composite material itself is not suitable for tapping to make threads. In the related art, usually pre-embedded metal parts or post-glued metal frames are followed by secondary pressurization to manufacture electronic equipment casings. Duri...

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Problems solved by technology

In the molding process of this method, the parameters of the molding process are difficult to control, and the product is a thin-walled special-shaped part. The design of the molding die is difficult, and problems such as wrinkles, poor glue, and rich glue are prone to occur after molding.

In addition, the above method makes the case easily delaminated when it is subjected to thermal shock and force shock, and the mechanism of the electronic device case is complicated, which brings great difficulties to its production, and the production cost of the above-mentioned electronic device case is high. Difficult to achieve mass production

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