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Back adhesive process for three-dimensional steel reinforcing product of 5G chip circuit board

A circuit board and product technology, applied in the field of 5G chip circuit board three-dimensional steel reinforcement product back glue technology, can solve the problems of low yield, difficult production, sticking to the punch, etc., to achieve yield improvement, simple operation, good quality rate significant effect

Pending Publication Date: 2021-12-28
深圳市腾鑫精密电子芯材科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the existing technology, the back glue process of the reinforcing board is to paste the glue first and then punch the shape. The bending punch will crush the double-sided adhesive; The rate is low, so the present invention provides a 5G chip circuit board three-dimensional steel reinforcement product adhesive process

Method used

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  • Back adhesive process for three-dimensional steel reinforcing product of 5G chip circuit board
  • Back adhesive process for three-dimensional steel reinforcing product of 5G chip circuit board
  • Back adhesive process for three-dimensional steel reinforcing product of 5G chip circuit board

Examples

Experimental program
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Effect test

Embodiment 1

[0028] Such as Figure 1-4 As shown, the present invention provides a 5G chip circuit board three-dimensional steel reinforcement product adhesive process, including the following steps:

[0029] Step 1: Unload the material from the warehouse, and cut and bend the product at the unfolded place, and place the bending connection point at the rounded corner of the product;

[0030] Step 2: Use the precision stamping die to stamp the product. The stamping area must be located in the area to be stamped, and fine-tune the clearance of the mold to produce qualified products;

[0031] Step 3: Use a washing machine to wash the stamped mold, and conduct a full inspection of the washed product according to the qualified standard;

[0032] Step 4: Paste the adhesive layer on the surface of the reinforcement board with a jig, then paste the adhesive layer on the surface of the adhesive layer, and use a pressing machine to heat the glue, and conduct a full inspection of the glued product a...

Embodiment 2

[0044] Such as Figure 1-4 As shown, the present invention provides a 5G chip circuit board three-dimensional steel reinforcement product adhesive process, including the following steps:

[0045] Step 1: Unload the material from the warehouse, and cut and bend the product at the unfolded place, and place the bending connection point at the rounded corner of the product;

[0046] Step 2: Use the precision stamping die to stamp the product. The stamping area must be located in the area to be stamped, and fine-tune the clearance of the mold to produce qualified products;

[0047] Step 3: Use a washing machine to wash the stamped mold, and conduct a full inspection of the washed product according to the qualified standard;

[0048] Step 4: Paste the adhesive layer on the surface of the reinforcement board with a jig, then paste the adhesive layer on the surface of the adhesive layer, and use a pressing machine to heat the glue, and conduct a full inspection of the glued product a...

Embodiment 3

[0060] Such as Figure 1-4 As shown, the present invention provides a 5G chip circuit board three-dimensional steel reinforcement product adhesive process, including the following steps:

[0061] Step 1: Unload the material from the warehouse, and cut and bend the product at the unfolded place, and place the bending connection point at the rounded corner of the product;

[0062] Step 2: Use the precision stamping die to stamp the product. The stamping area must be located in the area to be stamped, and fine-tune the clearance of the mold to produce qualified products;

[0063] Step 3: Use a washing machine to wash the stamped mold, and conduct a full inspection of the washed product according to the qualified standard;

[0064] Step 4: Paste the adhesive layer on the surface of the reinforcement board with a jig, then paste the adhesive layer on the surface of the adhesive layer, and use a pressing machine to heat the glue, and conduct a full inspection of the glued product a...

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Abstract

The invention discloses a back adhesive process for a three-dimensional steel reinforcing product of a 5G chip circuit board. The back adhesive process comprises the following steps: (1) blankingfrom a warehouse, cutting, bending and unfolding the product, and placing product fillets at bent connecting points; (2) utilizing a precision stamping die to stamp the product, enabling a stamping area to be definitely positioned in a to-be-stamped section, performing gap fine adjustment on the die, and producing the qualified product; (3) flushing the die after stamping through a flushing machine, and performing full inspection on the flushed product according to qualification standards; and (4) sticking an adhesive sticking layer on the surface of the reinforcing plate through a jig, then sticking an adhesive pressing layer on the surface of the adhesive sticking layer, utilizing a pressing machine to heat up adhesive, and performing full inspection on the product subjected to adhesive sticking according to the qualification standards. Through the procedures of firstly stamping and cleaning and then transferring to adhesive sticking, the reinforcing plate and the adhesive sticking layer are effectively combined, and then SHEET sleeve sticking is carried out to form the final finished product required by a client. The whole process is free of redundant action waste, simple in operation, and significantly improved in yield rate.

Description

technical field [0001] The invention relates to the technical field of adhesive backing technology, in particular to an adhesive backing technology for three-dimensional steel reinforcement products of 5G chip circuit boards. Background technique [0002] The reinforcement board is also called a reinforcement board, a reinforcement board, a support board, a reinforcement board, and a reinforcement rib. Reinforcing plates are mainly used in construction, oil pipelines, mechanical equipment, electronic products, etc. It is widely used in FPC flexible circuit boards in electronic products. The reinforcement board mainly solves the flexibility of the flexible circuit board, improves the strength of the plug-in part, and facilitates the overall assembly of the product. The reinforcement board mainly includes stainless steel reinforcement board, aluminum foil reinforcement board, polyester reinforcement board, polyimide reinforcement board, glass fiber reinforcement board, PTFE ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C65/74B29C65/20B29C65/50B29C65/00B29L9/00B29L31/34
CPCB29C65/741B29C66/02241B29C66/026B29C65/5007B29C65/20B29C66/45B29C66/742B29L2009/003B29L2031/3406
Inventor 邱德振蔡振猛张春海
Owner 深圳市腾鑫精密电子芯材科技有限公司