Semiconductor circuit and method for manufacturing semiconductor circuit
A semiconductor and circuit technology, applied in the field of semiconductor circuit applications, can solve problems such as complex mounting holes and low product production efficiency
Pending Publication Date: 2021-12-28
广东汇芯半导体有限公司
View PDF0 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0003] The technical problem to be solved in the present invention is to solve the problem that the design of the mounting hole of the sealing layer of the existing semiconductor circuit is complicated and leads to low production efficiency of the whole product
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0037] It should be noted that, under the condition that there is no conflict in structure or function, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below based on examples.
[0038] The semiconductor circuit mentioned in the present invention is a circuit module that integrates power switching devices and high-voltage drive circuits, and is sealed and packaged on the outside. It is widely used in the field of power electronics, such as frequency converters for driving motors, Various inverter voltage, frequency conversion speed regulation, metallurgical machinery, electric traction, frequency conversion home appliances and other fields. There are many other names for the semiconductor circuit here, such as Modular Intelligent Power System (MIPS), Intelligent Power Module (IPM), or hybrid integrated circuit, power semiconductor module, power name of the module et...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to a semiconductor circuit and a manufacturing method of the semiconductor circuit. The semiconductor circuit comprises a circuit substrate, a circuit wiring layer, an insulating layer, a plurality of electronic elements, a plurality of pins and a sealing layer. The circuit substrate comprises a mounting surface and a heat dissipation surface, the insulating layer is arranged on the mounting surface, the circuit wiring layer is arranged on the surface of the insulating layer, the circuit wiring layer is provided with a plurality of element mounting positions and bonding pads, the plurality of pins are arranged on at least one side of the circuit substrate, and the sealing layer at least wraps one surface of the circuit substrate provided with electronic elements. The other ends of the plurality of pins are exposed from the sealing layer, two ends of the sealing layer are provided with mounting holes penetrating through the thickness of the sealing layer, and the surfaces of the mounting holes are flush with the surface of the sealing layer. Compared with the complicated design of the mounting hole in the prior art, the surface of the mounting hole is flush with the surface of the sealing layer, so that the mounting hole only needs to be designed and formed synchronously with the working procedure of the sealing layer body, and the production working procedure is effectively simplified.
Description
technical field [0001] The invention relates to a semiconductor circuit and a method for manufacturing the semiconductor circuit, belonging to the technical field of semiconductor circuit applications. Background technique [0002] A semiconductor circuit is a power drive product that combines power electronics and integrated circuit technology. The outer surface of the semiconductor circuit is generally encapsulated by an injection-molded resin material to form a sealing layer, which seals the internal circuit board and electronic components, and the pins protrude from one or both sides of the sealing layer. The two ends of the sealing layer are generally provided with mounting holes for fixing. The current design of the mounting holes is relatively complicated and requires a separate process, which affects the production efficiency of the entire product. Contents of the invention [0003] The technical problem to be solved by the present invention is to solve the proble...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): H01L23/31H01L21/56
CPCH01L23/3114H01L23/3121H01L21/56
Inventor 冯宇翔
Owner 广东汇芯半导体有限公司