Full-automatic manipulator based on six-direction pressure feedback

Abstract

The invention discloses a full-automatic manipulator on six-direction pressure feedback. The full-automatic manipulator comprises a feeding mechanism, a bearing platform and a manipulator body, wherein the manipulator body comprises a three-axis mechanical arm, pressure sensors and an adsorption platform, six sets of connecting holes are formed in the lower end part where the three-axis mechanical arm is located, the three-axis mechanical arm is connected with miniature connecting columns through telescopic pieces in the connecting holes respectively, the lower end parts of the micro connecting columns are connected with the adsorption platform, the positions, right opposite to the micro connecting columns, of the front end part of the adsorption platform are provided with the pressure sensors respectively, the adsorption platform adsorbs a wafer substrate on a material disc piece, and then the wafer substrate is transferred through the three-axis mechanical arm. By using the full-automatic manipulator disclosed by the invention, after the adsorption platform is firstly in contact with the wafer substrate, the relative position of the adsorption platform is adjusted to be matched with the wafer substrate according to pressure feedback during contact, so that the accuracy of the wafer substrate in the transfer process is greatly improved, and the transfer efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of manipulator equipment, and in particular relates to a fully automatic manipulator based on six-way pressure feedback. Background technique [0002] At present, the attachment machine is mainly used for the placement process of electrical components. Generally, a glass platform is used, and the attachment head is driven by a precision ball screw to ensure positional accuracy. [0003] In the Chinese patent application number CN201921155835.9, a rotary transposition device for blue film wafer packaging is disclosed, including a support, a bottom plate and a workbench. The graphite disk to be transposed is placed on the workbench, and the rotary transposition device It also includes a movable arm and a rotating bracket arranged above the workbench. The rotating bracket is provided with a suction nozzle capable of absorbing and lifting the graphite disk. One end of the movable arm is movably installed on the...

AI Technical Summary

Problems solved by technology

[0004] The current attachment machine does not have a pressure feedback system in the actual use process. It is only to ensure the flatness of the attachment platform. On this basis, the best attachment position is obtained after debugging, and the attachment is performed. There is no real-time pressure feedback system and no real-time monitoring. If the flatness of the platform changes, it needs to be re-adjusted, and continuous production cannot be carried out, which seriously affects the progress of patch dispensing

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