A soic package high temperature sorting test equipment

Abstract

The invention discloses a SOIC packaging high-temperature sorting test equipment, which includes a cabinet electric box mechanism, a feed turret module, a high-temperature turret module, a discharge turret module, and a high-temperature test equipment control system and a feed turret module, Both the high temperature turret module and the discharge turret module are connected by communication. The equipment fully heats up SOIC packaged products under high-temperature climate conditions to realize electrical performance testing under high-temperature conditions. The product quality inspection requirements after the high-temperature test are met, and the adaptability inspection for storage, transportation and use of SOIC packaging products under simulated high-temperature climate environment conditions is realized by implementing the invention. Its advantages are mainly reflected in the reduction of production management costs; it simplifies the production process of product testing, reduces the handling and transit storage of products, and requires a small footprint; improves the production efficiency of product testing, reduces the types of product testing and production equipment, and reduces equipment maintenance costs.

Description

technical field [0001] The invention relates to a production test equipment for semiconductor devices, more specifically, the invention relates to a high-temperature sorting test equipment for SOIC packaging. Background technique [0002] The SOIC package is a small-outline surface-mount integrated circuit package. Its outer leads (pins) are not more than 28 small-outline integrated circuits. It is derived from the SOP (Small Out-Line Package) package and generally has a width of Both body and narrow body packages are available. It takes about 30-50% less space and about 70% less thickness than an equivalent DIP package. High-temperature testing is required in the production process of some SOIC packaging products to determine the adaptability of products for storage, transportation, and use under high-temperature climate conditions. The severity of the test depends on the temperature and duration of exposure to the elevated temperature. The product quality after the high...

AI Technical Summary

Problems solved by technology

[0004] The shortcomings and deficiencies of this technique are mainly reflected in the following: first, it increases the cost of production management; second, the way of sampling inspection is weak in controlling the quality of the product, and the quality is unstable; third, the production process of product testing is complicated , requires a large amount of handling and transit storage, and requires a large floor space; fourth, the production efficiency of product testing is low, and fifth, there are many types of product testing and production equipment, which increases equipment maintenance costs

Sixth, the product efficiency is low and the manufacturing cost is high

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