SOIC packaging high-temperature sorting test equipment

Abstract

The invention discloses SOIC packaging high-temperature sorting test equipment which comprises a cabinet electric box mechanism, a feeding turret module, a high-temperature turret module and a discharging turret module, and a high-temperature test equipment control system is in communication connection with the feeding turret module, the high-temperature turret module and the discharging turret module. The equipment fully cooks and heats the SOIC packaged product in a high-temperature climate environment condition, and realizes the electrical performance test in a high-temperature environment state. According to the method, the quality inspection requirements of products after high-temperature tests are met, and adaptability inspection of storage, transportation and use of the SOIC packaging products under the simulated high-temperature climate environment condition is achieved. The equipment has the main advantages that the production management cost is reduced; the product testing production process is simplified, carrying and transfer storage of products are reduced, and the needed occupied space is small; and the product test production efficiency is improved, the types of product test production equipment are reduced, and the equipment maintenance cost is reduced.

Description

technical field [0001] The invention relates to a production test equipment for semiconductor devices, more specifically, the invention relates to a high-temperature sorting test equipment for SOIC packaging. Background technique [0002] The SOIC package is a small-outline surface-mount integrated circuit package. Its outer leads (pins) are not more than 28 small-outline integrated circuits. It is derived from the SOP (Small Out-Line Package) package and generally has a width of Both body and narrow body packages are available. It takes about 30-50% less space and about 70% less thickness than an equivalent DIP package. High-temperature testing is required in the production process of some SOIC packaging products to determine the adaptability of products for storage, transportation, and use under high-temperature climate conditions. The severity of the test depends on the temperature and duration of exposure to the elevated temperature. The product quality after the high...

AI Technical Summary

Problems solved by technology

[0004] The shortcomings and deficiencies of this technique are mainly reflected in the following: first, it increases the cost of production management; second, the way of sampling inspection is weak in controlling the quality of the product, and the quality is unstable; third, the production process of product testing is complicated , requires a large amount of handling and transit storage, and requires a large floor space; fourth, the production efficiency of product testing is low, and fifth, there are many types of product testing and production equipment, which increases equipment maintenance costs

Sixth, the product efficiency is low and the manufacturing cost is high

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