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Energy-saving nozzle and electroplating device

A technology of nozzles and mounting parts, which is applied in the field of electroplating production equipment, can solve the problems of high cost, small spray flow, energy waste, etc., and achieve the effect of low cost, increased spray flow, and increased flow

Pending Publication Date: 2022-01-04
惠州市本正智能设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the ejection flow rate of the existing nozzles is relatively small during jet flow, and the ejection flow rate at the outlet end is limited. In order to increase the ejection flow rate of the nozzle, a higher-power pressure pump is required to provide it to the nozzle, and the cost of continuous production is high. , resulting in a waste of energy

Method used

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  • Energy-saving nozzle and electroplating device
  • Energy-saving nozzle and electroplating device
  • Energy-saving nozzle and electroplating device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] refer to figure 1 and figure 2 , figure 1 It is the sectional structure schematic diagram of the energy-saving nozzle in the embodiment, figure 2 It is a schematic diagram of the structure of the energy-saving nozzle in the embodiment. The energy-saving nozzle in this embodiment includes a nozzle assembly 1 and a nozzle seat assembly 2 , one end of the nozzle assembly 1 is connected to one end of the nozzle seat assembly 2 .

[0032] refer to figure 1 , figure 2 and image 3 , image 3 It is a structural schematic diagram of the nozzle assembly in the embodiment. The nozzle assembly 1 includes a mounting part 11, a channel part 12 and a nozzle part 13. A channel 121 is formed inside the channel part 12, and a return port 122 communicating with the channel 121 is provided on the side wall of the channel part 12. One end of the channel part 12 is arranged on the mounting part 11. The nozzle part 13 is disposed on the installation part 11 and located in the chan...

Embodiment 2

[0041] refer to Figure 6 , Figure 6 It is a structural schematic diagram of the electroplating device in the embodiment. This embodiment discloses an electroplating device, which includes two nozzle installation lines 3 oppositely arranged, and each nozzle installation line 3 is respectively equipped with a plurality of the above-mentioned energy-saving nozzles 1, and the plurality of nozzle installation lines 3 on the two nozzle installation lines 3 Two energy-saving nozzles 1 are arranged in relative dislocation to prevent that in the electroplating process, the energy-saving nozzles on both sides reduce the jet flow due to the relative collision of the electroplating solution sprayed out, which affects the effect of spraying. Wherein the energy-saving nozzle 1 is the energy-saving nozzle 1 of Embodiment 1, so that the electroplating device in this embodiment can make the PCB board Both sides are covered by uniform jet flow, which improves the plating effect at a lower m...

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PUM

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Abstract

The invention discloses an energy-saving nozzle and an electroplating device. The energy-saving nozzle comprises a nozzle assembly; and the nozzle assembly comprises a mounting part, a channel part and a nozzle part, a channel is formed in the channel part, backflow ports communicating with the channel are formed in the side wall of the channel part, one end of the channel part is arranged on the mounting part, the nozzle part is arranged on the mounting part and located in the channel, a nozzle of the nozzle part extends towards the other end of the channel part, and the nozzle of the nozzle part is opposite to the backflow ports. The nozzle of the nozzle part corresponds to the backflow ports in the channel part, a negative pressure difference can be formed in the backflow ports, electroplating liquid around the nozzle quickly flows back into the channel through the backflow ports, the flow of the nozzle during jet flow is increased, the jet flow of the nozzle is increased under the condition that the power of a pressure pump is not increased, the continuous production cost is low, and energy saving and environmental protection are achieved.

Description

technical field [0001] The invention relates to the technical field of electroplating production equipment, in particular to an energy-saving nozzle and an electroplating device. Background technique [0002] In the process of circuit board processing, it needs to be electroplated in the electroplating pool to thicken it (commonly known as plate plating), or conduct holes (commonly known as filling holes). Spray to the circuit board to achieve efficient electroplating processing of the circuit board. This process plays a decisive role in the thickness of the copper plating on the circuit board or the uniformity of hole filling. [0003] In the related art, rows of nozzles are arranged on both sides of the electroplating pool, and the electroplating solution is sprayed onto the circuit board through the nozzles after being pressurized by a pump. However, the ejection flow rate of the existing nozzles is relatively small during jet flow, and the ejection flow rate at the outl...

Claims

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Application Information

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IPC IPC(8): C25D5/08C25D17/00H05K3/24H05K3/42
CPCC25D5/08C25D17/00H05K3/241H05K3/423
Inventor 谢建平梁尔锋
Owner 惠州市本正智能设备有限公司