Energy-saving nozzle and electroplating device
A technology of nozzles and mounting parts, which is applied in the field of electroplating production equipment, can solve the problems of high cost, small spray flow, energy waste, etc., and achieve the effect of low cost, increased spray flow, and increased flow
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Embodiment 1
[0031] refer to figure 1 and figure 2 , figure 1 It is the sectional structure schematic diagram of the energy-saving nozzle in the embodiment, figure 2 It is a schematic diagram of the structure of the energy-saving nozzle in the embodiment. The energy-saving nozzle in this embodiment includes a nozzle assembly 1 and a nozzle seat assembly 2 , one end of the nozzle assembly 1 is connected to one end of the nozzle seat assembly 2 .
[0032] refer to figure 1 , figure 2 and image 3 , image 3 It is a structural schematic diagram of the nozzle assembly in the embodiment. The nozzle assembly 1 includes a mounting part 11, a channel part 12 and a nozzle part 13. A channel 121 is formed inside the channel part 12, and a return port 122 communicating with the channel 121 is provided on the side wall of the channel part 12. One end of the channel part 12 is arranged on the mounting part 11. The nozzle part 13 is disposed on the installation part 11 and located in the chan...
Embodiment 2
[0041] refer to Figure 6 , Figure 6 It is a structural schematic diagram of the electroplating device in the embodiment. This embodiment discloses an electroplating device, which includes two nozzle installation lines 3 oppositely arranged, and each nozzle installation line 3 is respectively equipped with a plurality of the above-mentioned energy-saving nozzles 1, and the plurality of nozzle installation lines 3 on the two nozzle installation lines 3 Two energy-saving nozzles 1 are arranged in relative dislocation to prevent that in the electroplating process, the energy-saving nozzles on both sides reduce the jet flow due to the relative collision of the electroplating solution sprayed out, which affects the effect of spraying. Wherein the energy-saving nozzle 1 is the energy-saving nozzle 1 of Embodiment 1, so that the electroplating device in this embodiment can make the PCB board Both sides are covered by uniform jet flow, which improves the plating effect at a lower m...
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