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Electronic equipment and circuit board assembly thereof

A circuit board assembly and main circuit board technology, which is applied to printed circuit parts, electrical components, printed circuits, etc., can solve the problems of large circuit board area, unfavorable thinner and miniaturized design of electronic equipment, and reduce wiring Impedance, reduced area, and the effect of meeting impedance requirements

Pending Publication Date: 2022-01-04
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the complexity of circuit functions, the refinement of circuit lines, and the trend of thinner and thinner electronic equipment, the stacking of electronic components and the utilization of circuit board space have become more and more important. The surface of the board is stacked with electronic components, making the area of ​​the circuit board larger and larger, which is not conducive to the thinner and smaller design of electronic equipment

Method used

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  • Electronic equipment and circuit board assembly thereof
  • Electronic equipment and circuit board assembly thereof
  • Electronic equipment and circuit board assembly thereof

Examples

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Embodiment Construction

[0021] The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments. In particular, the following examples are only used to illustrate the present invention, but not to limit the scope of the present invention. Likewise, the following embodiments are only some but not all of the embodiments of the present invention, and all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0022] Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present invention. The occurrences of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is understoo...

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Abstract

The invention provides electronic equipment and a circuit board assembly thereof. The circuit board assembly comprises a main circuit board, a heightening plate and a control chip. The main circuit board is provided with a first electronic component; the heightening plate is attached to and electrically connected with the surface of the main circuit board, a through containing groove is formed in the heightening plate in the thickness direction, and a second electronic component connected with the main circuit board is arranged in the containing groove; the control chip is attached to and electrically connected with the surface of the side, away from the main circuit board, of the heightening plate; the control chip covers the containing groove in the heightening plate. According to the circuit board assembly provided by the embodiment of the invention, the containing groove for accommodating the electronic components is formed in the heightening plate, so that the capacity of the circuit board can be improved in space, and the area of the circuit board is reduced. The space layout of the main circuit board is utilized to the maximum extent, the distance between the first electronic component and the second electronic component can be shortened, so that the wiring impedance is reduced, the impedance requirement is met, and in addition, the stress problem of the chip with a large area can be solved.

Description

technical field [0001] The invention relates to the technical field of circuit board stacking structures, in particular to an electronic device and a circuit board assembly thereof. Background technique [0002] Electronic products in life can be seen everywhere, and their functions need to be realized by the circuit board inside. With the complexity of circuit functions, the refinement of circuit lines, and the trend of thinner and lighter electronic equipment, the stacking of electronic components and the utilization of circuit board space have become more and more important. Electronic components are stacked on the surface of the board, making the area of ​​the circuit board larger and larger, which is not conducive to the thinning and miniaturization design of electronic equipment. Contents of the invention [0003] The first aspect of the embodiment of the present application provides a circuit board assembly, and the circuit board assembly includes: [0004] the ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K1/02
CPCH05K1/182H05K1/025H05K2201/10568
Inventor 徐奇锋
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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