Integrated circuit packaging finished product detection equipment

A technology for integrated circuits and testing equipment, applied in the field of testing equipment for integrated circuit packaged products, can solve problems such as inconvenience, low testing efficiency, and easy testing deviation, and achieve the effects of accurate testing, reducing wear and protecting integrated circuits

Pending Publication Date: 2022-01-14
深圳台达创新半导体有限公司
View PDF11 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a detection device for integrated circuit packaged products, to solve the problem in the above background technology that after the current integrated circuit is packaged, it needs to be tested to detect whether the packaged integrated circuit is still in normal condition. state, when the existing integrated circuit is tested, it is usually detected manually. When two detections are manually clamped to detect the integrated circuit, it is necessary to align the detection needle with the joint position of each integrated circuit, which is very inconvenient, and it is very inconvenient during the detection When it is necessary to ensure the stability of the integrated circuit, the manual workload is far away, and the detection efficiency is low, and the detection is prone to deviation problems

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Integrated circuit packaging finished product detection equipment
  • Integrated circuit packaging finished product detection equipment
  • Integrated circuit packaging finished product detection equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] see Figure 1-10 , the present invention provides a technical solution: a detection device for integrated circuit packaging products, including a detection table 1, the bottom of the detection table 1 is provided with a positioning mechanism for locating the integrated circuit, and the positioning mechanism can automatically make the device placed on the top of the detection table 1 After the integrated circuit is moved and positioned at the exact position for detection, the detection platform 1 is equipped with a follow-up mechanism for reducing the friction between the bottom of the integrated circuit and the test platform 1 when the integrated circuit moves. The follow-up mechanism automatically moves to the accurate position after the integrated circuit moves Separated from the integrated circuit, the top of the detection table 1 is provided with a detection mechanism for automatically moving to detect the integrated circuit;

[0030]The positioning mechanism includ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses detection equipment for an integrated circuit packaging finished product in the technical field of detection of integrated circuit packaging finished products. The detection equipment comprises a detection table, wherein a positioning mechanism used for positioning an integrated circuit is arranged at the bottom of the detection table. According to the invention, when a packaged integrated circuit needs to be detected every time, the integrated circuit is slowly pushed to an accurate detection position through a positioning mechanism; and in a pushing process, by matching with a follow-up rotating mechanism, the follow-up rotating mechanism is in a protruding state firstly and elastically supports the integrated circuit, when the integrated circuit is pushed, abrasion of the integrated circuit is reduced through follow-up movement so as to protect the integrated circuit and prevent the the integrated circuit from being damaged in the automatic adjustment process, and after the integrated circuit is pushed in place, the follow-up rotating mechanism automatically retracts under the action of the positioning mechanism, so that the bottom of the integrated circuit completely makes contact with the top of the detection table, the integrated circuit is prevented from being extruded to be bent and damaged in the detection process, the integrated circuit is protected, the whole process is automatically carried out, and convenience and rapidness are realized.

Description

technical field [0001] The invention relates to the technical field of detection of integrated circuit packaged products, in particular to a detection device for integrated circuit packaged products. Background technique [0002] The position of integrated circuit packaging in the electronics pyramid is both the apex and the base of the pyramid, because the types of integrated circuits vary widely, and the needs and requirements for packaging are also different. Integrated circuit packaging must also fully adapt to the needs and development of electronic equipment. Due to the different functions of various electronic equipment and instruments, their overall structure and assembly requirements are often different. Therefore, integrated circuit packaging must be diverse. It is enough to meet the needs of various complete machines. In this way, the integration level of integrated circuits is required to be higher and higher, and the functions are more and more complex. The vol...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28G01R1/02G01R1/04
CPCG01R31/2851G01R31/2896G01R31/2886G01R31/2894G01R1/02G01R1/04G01R1/0408
Inventor 朱丽华曹祥俊
Owner 深圳台达创新半导体有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products