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Chip packaging structure and manufacturing method thereof

A packaging structure and chip technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as unacceptable installation, limited heat dissipation methods, and impermissibility, and achieve high heat dissipation efficiency.

Pending Publication Date: 2022-01-14
QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In most practical packaging applications, due to reasons such as size and height limit, it is not allowed or unacceptable to install heat sinks, so the traditional heat dissipation methods have great limitations.

Method used

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  • Chip packaging structure and manufacturing method thereof
  • Chip packaging structure and manufacturing method thereof
  • Chip packaging structure and manufacturing method thereof

Examples

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Embodiment Construction

[0031] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0032] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0033] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0034] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention discloses a chip packaging structure and a manufacturing method thereof. The packaging structure comprises a PCB (Printed Circuit Board), a chip and a packaging layer; the chip is arranged on the first side of the PCB and is electrically connected with the PCB; and the packaging layer is arranged on the first side of the PCB, a pipeline is arranged in the packaging layer, the pipeline is filled with a cooling medium used for phase-change heat exchange, and the packaging layer covers the chip and the pipeline.

Description

technical field [0001] The invention belongs to the technical field of packaging, and in particular, the invention relates to a chip packaging structure and a manufacturing method of the chip packaging structure. Background technique [0002] The existing packaging structure usually adopts the heat dissipation technology of the transmission package module, such as mounting heat sinks to achieve heat dissipation. In most practical packaging applications, due to reasons such as volume and height restrictions, it is not allowed or unacceptable to install a heat sink, so the traditional heat dissipation method has great limitations. Contents of the invention [0003] An object of the present invention is to provide a chip packaging structure. [0004] Another object of the present invention is to provide a method for manufacturing a chip packaging structure. [0005] According to the first aspect of the present invention, there is provided a chip packaging structure, includi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/427H01L23/31H01L21/56
CPCH01L23/427H01L23/3114H01L23/3121H01L21/56
Inventor 陈锡波
Owner QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD
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