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Capacitor assembly and method for connecting electronic capacitor to carrier substrate

A technology for capacitor components, carrier substrates, applied in the direction of fixed capacitor dielectrics, capacitors, stacked capacitors, etc.

Pending Publication Date: 2022-01-18
ROBERT BOSCH GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Ceramic capacitors can have the disadvantage of piezoelectric effect

Method used

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  • Capacitor assembly and method for connecting electronic capacitor to carrier substrate
  • Capacitor assembly and method for connecting electronic capacitor to carrier substrate
  • Capacitor assembly and method for connecting electronic capacitor to carrier substrate

Examples

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Effect test

Embodiment Construction

[0022] as from figure 1 and figure 2 As can be seen in , the illustrated embodiment of a capacitor assembly 1 according to the invention comprises an electronic capacitor 10 and a carrier substrate 3 . The connection contacts 12 of the electronic capacitor 10 are connected electrically and mechanically to the corresponding contact regions 5 of the carrier substrate 3 via solder connections 15 , wherein spacers 14 are respectively embedded in the solder 16 of the respective solder connections 15 , which The spacers predefine the width of the resulting air gap 18 between the electronic capacitor 10 and the carrier substrate 3 . The electronic capacitor 10 is here a multilayer ceramic capacitor 10A with piezoelectric effect, wherein the contact surface 12 . 1 of the corresponding connection contact 12 of the ceramic capacitor 10A rests directly on the corresponding contact surface 14 . The width of the generated air gap 18 is predetermined so that the vibration caused by the p...

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Abstract

The invention relates to a capacitor assembly (1) and a method for connecting an electronic capacitor (10) to a carrier substrate (3). The capacitor assembly comprising an electronic capacitor (10) and a carrier substrate (3). A connection contact (12) of the electronic capacitor (10) is electrically and mechanically connected to a corresponding contact region (5) of the carrier substrate (3) by means of a solder connection (15). A spacer (14) is embedded in the solder (16) of each solder connection (15). The spacer specifies the width of a generated air gap (18) between the electronic capacitor (10) and the carrier substrate (3). In this case, the electronic capacitor (10) is a multilayer ceramic capacitor (10A) having a piezoelectric effect, wherein the contact surface (12.1) of the respective connection contact (12) of the ceramic capacitor (10A) lies directly on the contact surface (14.1) of the respective spacer (14), and the width of the generated air gap (18) is predetermined in such a way that vibrations caused by the piezoelectric effect of the multilayer ceramic capacitor (10A) are attenuated and reduced.

Description

technical field [0001] The invention relates to a capacitor assembly of the type according to independent claim 1 . The object of the invention is also a method for connecting an electronic capacitor to a carrier substrate. Background technique [0002] Multilayer ceramic capacitors (MLCC: Multi-Layer Ceramic Capacitors) are known from the prior art, which are arranged on a carrier substrate, more precisely on a printed circuit board, and which can be used in various ways in circuits or controllers. Ceramic capacitors can suffer from the piezoelectric effect. This means that ceramic capacitors can exhibit a mechanical length change depending on the material properties and the applied AC voltage. The resulting vibrations can couple directly into the ambient air or into the carrier substrate or printed circuit board and cause acoustic as well as micromechanical disturbances. [0003] Such a capacitor assembly and such a method for connecting an electronic capacitor to a car...

Claims

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Application Information

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IPC IPC(8): H05K3/30H05K3/34
CPCH05K3/301H05K3/341H05K2201/10015H01G2/06H01G4/30B23K2101/42B23K1/0016B23K1/203H01G4/12H05K2201/2036H05K2201/2045H05K1/0271H05K3/303H05K3/3442H05K2201/10636Y02P70/50
Inventor S·巴尔茨
Owner ROBERT BOSCH GMBH
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