Vibration monitoring system and vibration monitoring method for grinding platform
A vibration monitoring system, grinding platform technology, applied in measuring devices, measuring ultrasonic/sonic/infrasonic waves, instruments, etc., can solve problems such as abnormal wafer grinding, and achieve the effect of avoiding wafer damage or poor wafer process.
Pending Publication Date: 2022-01-25
泉芯集成电路制造(济南)有限公司
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[0004] In order to solve the above technical problems, this application provides a vibration monitoring system and vibration monitoring method of a grinding platform to solve the problem of abnormal grinding of wafers by mask platforms due to abnormal vibration of the transmission system in the prior art
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[0035] As mentioned in the background technology, the grinding platform in the prior art may cause abnormal grinding of the wafer by the grinding system driven by the transmission system due to the abnormal vibration of the transmission system during the working process, which may lead to insufficient flatness of the wafer surface. Good or cause the wafer to be broken due to vigorous grinding.
[0036] For the specific Reflexion LK model, its transmission system includes motors and belts. The rotation of the motor is directly transmitted through the belt, which drives the grinding system to rotate for wafer grinding. After the platform has been running for a long time, the belt may Excessive spacing can occur due to wear (refer to figure 1 , figure 1 The tooth pitch of the middle belt is worn) and jumps (refer to figure 2 ) or belt tension asymmetry, etc., causing the belt to deviate (refer to image 3 ), causing belt wear.
[0037] When the belt vibrates abnormally, the ...
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The invention discloses a vibration monitoring system and vibration monitoring method for a grinding platform, the vibration monitoring system for the grinding platform is provided with a first monitoring module and a second monitoring module on the two sides of the conveying surface of a belt respectively, and the first monitoring module is used for sending a monitoring signal to the conveying surface of the belt; the second monitoring module is used for receiving the monitoring signals except the monitoring signals shielded by the belt, the abnormal state of the belt is monitored according to the received monitoring signals, monitoring of the working state of the grinding platform is achieved, a foundation is laid for judging whether the working state of the grinding platform is abnormal or not, the problem that in the prior art, due to abnormal vibration of the belt, the wafer is abnormally ground by the grinding platform is solved, and wafer damage or poor wafer manufacturing process caused by the problem is avoided.
Description
technical field [0001] The present application relates to the field of semiconductor technology, and more specifically, to a vibration monitoring system and a vibration monitoring method of a grinding platform. Background technique [0002] In the process of chip manufacturing and wafer processing, chemical mechanical polishing (Chemical MechanicalPolishing, CMP) is an important step to obtain a scratch-free, flat and impurity-free surface. This step can also be called a grinding step. [0003] During the working process of the existing grinding platform, the abnormal grinding of the wafer by the grinding platform may be caused by the abnormal vibration of the transmission system, resulting in damage to the wafer or poor wafer process. Contents of the invention [0004] In order to solve the above technical problems, the present application provides a vibration monitoring system and a vibration monitoring method of a polishing platform to solve the problem in the prior art...
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IPC IPC(8): G01H17/00
CPCG01H17/00Y02P70/10
Inventor 叶顺成
Owner 泉芯集成电路制造(济南)有限公司