Cover film repasting method, flexible circuit board and manufacturing method of flexible circuit board
A flexible circuit board and cover film technology, which is applied in the fields of printed circuit manufacturing, printed circuit, and printed circuit secondary treatment, can solve problems such as easy contamination, appearance defects of flexible circuit boards, short circuits, etc., and achieve manufacturing quality and manufacturing efficiency Enhanced effect
Pending Publication Date: 2022-01-25
KINWONG ELECTRONICS TECH LONGCHUAN
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Problems solved by technology
[0004] The purpose of the embodiments of the present invention is to provide a cover film transfer method, a flexible circuit board and a manufacturing method thereof, so as to solve the technical problem in the prior art that the cover film is easily polluted when the cover film is transferred and causes the appearance defect or short circuit of the flexible circuit board
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[0045] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0046] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.
[0047] It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "outer" and other indicated orientations...
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The invention provides a cover film repasting method, a flexible circuit board and a manufacturing method of the flexible circuit board, and belongs to the technical field of flexible circuit boards. According to the cover film repasting method provided by the invention, the adopted cover film comprises a cover film body, a first adhesive layer and a release paper layer which are stacked, and the cover film repasting method comprises the steps of cutting, windowing, bearing film pasting and cover film pasting. The cover film adopted by the cover film repasting method is cut to obtain a plurality of cover films to be pasted, then the plurality of cover films to be pasted are made into a roll material and repasted to a bearing film, and finally release paper is torn off. The invention further provides a flexible circuit board and a manufacturing method thereof, and the cover film repasting method is adopted. According to the cover film repasting method, the flexible circuit board and the manufacturing method of the flexible circuit board, the cover film is cut firstly, then the release paper layer is torn off so as to guarantee that foreign matter cannot adhere to the adhesive face of the cover film to affect attractiveness, and short circuit caused by carbon powder cannot adhere to the adhesive face of the cover film.
Description
technical field [0001] The invention belongs to the technical field of flexible circuit boards, and more specifically relates to a covering film transfer method, a flexible circuit board adopting the cover film transfer method and a manufacturing method thereof. Background technique [0002] When making flexible board OLED (Organic Light-Emitting Diode, display module) products, it is easy to damage the circuit area on the FPC (Flexible Printed Circuit, flexible circuit board) when welding in places other than the circuit area , so it is necessary to protect the circuit area on the FPC but expose other areas. After cutting or punching the cover film, we will align and attach the cover film to the circuit area of the FPC. In the prior art, after the cover film is pasted on the carrier film, the release paper of the cover film is torn off to expose the AD glue (dry laminating adhesive AD, AD dry composite adhesive), and then the laser cutting process is used to obtain the F...
Claims
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Login to View More IPC IPC(8): H05K3/28
CPCH05K3/282
Inventor 左成伟杨凌云高明
Owner KINWONG ELECTRONICS TECH LONGCHUAN