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Dissolving solution for dissolving tin soldering flux and dissolving method

A technology of tin solder and dissolving solution, which is applied in the field of solution formulation of dissolved samples for material detection, can solve the problems of unguaranteed safety performance, difficulty in mastering, cumbersome operation, etc., and achieve the effect of fast measurement, improved analysis speed and simple operation

Pending Publication Date: 2022-01-28
JIANGXI HONGDU AVIATION IND GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The operation is cumbersome and difficult to master
During the operation, sulfuric acid needs to be used, and the safety performance of the operation cannot be guaranteed

Method used

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  • Dissolving solution for dissolving tin soldering flux and dissolving method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] When the volume ratio of nitric acid and fluoboric acid is 2:3, dissolve 0.1000g of solder, the brand of solder is S-Sn40PbSbA, and the heating temperature is 250°C.

[0023] The experimental results are: the volume of the lysate used is 20 milliliters, and the time used is 16 minutes. Using the dissolving solution of the original formula, the sample dissolving time is 25 minutes, and there is turbidity.

Embodiment 2

[0025] When the volume ratio of nitric acid and fluoboric acid is 2:3, dissolve 0.1000g of brazing solder, the grade is S-Sn30PbSbA, and the heating temperature is 250°C.

[0026] The experimental results are: the volume of the lysate used is 20 milliliters, and the time used is 10 minutes. Using the dissolution solution of the original formula, the sample dissolution time is 20 minutes, and there is turbidity.

Embodiment 3

[0028] When the volume ratio of nitric acid and fluoboric acid is 2:3, dissolve 0.1000g of brazing solder, the grade is S-Sn60PbSbA, and the heating temperature is 300°C.

[0029] The experimental results are: the volume of the lysate used is 20 milliliters, and the time used is 16 minutes. Using the dissolution solution of the original formula, the sample dissolution time is 20 minutes, and there is turbidity.

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Abstract

The invention relates to a dissolving solution for dissolving a tin soldering flux and a dissolving method of the tin soldering flux, and belongs to the field of solution formulas of material detection dissolving samples. According to the dissolving solution for dissolving the tin soldering flux and the dissolving method, the dissolving solution is composed of nitric acid and fluoboric acid, and the volume ratio of the nitric acid to the fluoboric acid is 2: 3. The method has the following advantages: 1, the method is simple to operate and is widely applied to a dissolving method when the tin soldering flux is measured by adopting the inductively coupled plasma atomic emission spectrometry; and 2, the method improves the analysis speed, meets the requirement of rapid determination on a production site, and is efficient, rapid and harmless.

Description

technical field [0001] The invention relates to a solution for dissolving solder and a method for dissolving solder, and belongs to the field of solution formula for material detection and dissolution samples. Background technique [0002] Solder is widely used in the production and life of military and civilian products. The commonly used national standards are GB10574.1 "Determination of tin content by chemical analysis method of tin-lead solder" and GB10574.2 "Determination of antimony content by chemical analysis method of tin-lead solder" Dissolve the sample solution in the sample for sample preparation. The operation is cumbersome and difficult to master. During the operation, sulfuric acid needs to be used, and the safety performance of the operation cannot be guaranteed. In order to improve the analysis speed and meet the needs of rapid determination on the production site, the formula of the solder dissolving solution was improved to obtain an efficient, fast and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N1/28
CPCG01N1/28
Inventor 周琳燕周芳古雅菁周力徐周珏
Owner JIANGXI HONGDU AVIATION IND GRP
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