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Semiconductor process equipment and gripping device

A technology of grabbing device and process equipment, which is applied in semiconductor/solid-state device manufacturing, transportation and packaging, conveyor objects, etc. It can solve problems such as debris and failure to take pieces, so as to ensure stability and success rate and improve transmission efficiency Effect

Pending Publication Date: 2022-01-28
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the shortcomings of the existing methods, the present application proposes a semiconductor process equipment and a grabbing device to solve the technical problems of chip picking failure and debris caused by wafer offset existing in the prior art

Method used

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  • Semiconductor process equipment and gripping device
  • Semiconductor process equipment and gripping device
  • Semiconductor process equipment and gripping device

Examples

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Embodiment Construction

[0026] The present application is described in detail below, and examples of embodiments of the present application are shown in the drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. Also, detailed descriptions of known technologies will be omitted if they are not necessary to illustrate the features of the present application. The embodiments described below by referring to the figures are exemplary only for explaining the present application, and are not construed as limiting the present application.

[0027] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art to which this application belongs. It should also be understood that terms, such as those defined in commonly used dictionaries, should be ...

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Abstract

The embodiment of the invention provides semiconductor process equipment and a grabbing device thereof. The grabbing device is connected with a driving device of the semiconductor process equipment, is used for grabbing and transmitting wafers, and comprises a shell, a driving mechanism and a plurality of clamping pieces; the shell is used for being connected with a driving device in the semiconductor process equipment and is used for moving under the driving of the driving device; the clamping pieces are connected with the shell and distributed at intervals in the circumferential direction of the shell, and the driving mechanism is used for selectively driving the clamping pieces to rotate at the same time so as to clamp or release the edge of the wafer. According to the embodiment of the invention, in the actual wafer grabbing process, the wafer, the multiple clamping pieces and the shell can be concentrically arranged, so that wafer grabbing failure caused by deviation of the wafer and the grabbing device or wafer falling and fragmentation caused by deviation of the wafer after successful grabbing are avoided; therefore, the wafer taking stability and success rate are ensured, and the wafer transmission efficiency and the wafer yield are improved.

Description

technical field [0001] The present application relates to the technical field of semiconductor processing, and in particular, the present application relates to a semiconductor process equipment and a grasping device. Background technique [0002] At present, the transmission system plays a vital role in the wet cleaning equipment in the field of integrated circuits. The way and position of the wafer pick-up affect the final process effect of the wafer, especially the stability during the pick-up process. sex. [0003] In the prior art, the front end of the grabbing device is fixedly provided with a front limit stopper, and the rear end is slidably provided with a rear limit stopper, and the movement of the rear limit stopper is controlled by a cylinder. During the grabbing process, the wafer is clamped by the two front limit stops and the rear limit stop pushed by the cylinder, but because of the Bernoulli gas protection between the carrier and the lower surface of the waf...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687H01L21/677
CPCH01L21/68707H01L21/677
Inventor 刘俊义王锐廷
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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