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Chip moving method and device

A chip and transfer chip technology, applied in the directions of transportation and packaging, conveyor objects, electrical components, etc., can solve the problem of low crystal bonding accuracy, and achieve the effect of improving accuracy

Pending Publication Date: 2022-02-01
SHENZHEN FONTAI IND TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problem of low die-bonding precision in the prior art, the application provides a chip moving method and device

Method used

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  • Chip moving method and device

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Embodiment Construction

[0033] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of this application, but not all of them. Based on the embodiments in the present application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present application.

[0034] figure 1 A schematic structural diagram of the gas operation head provided in the embodiment of the present application; figure 2 Another schematic diagram of the structure of the gas operation head provided in the embodiment of the present application; image 3 yes figure 1 side view of Figure 4-Figure 7 yes figure 1 Vari...

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Abstract

The invention relates to a chip moving method and device. The method comprises the steps of: moving a gas operation head so as to align an operation working face with to-be-transferred chips; controlling the position of at least one air port to be aligned with the corresponding to-be-transferred chip; controlling an air pressure device to extract air in a cavity structure of the air operation head so as to enable the at least one air port to adsorb the corresponding to-be-transferred chip; and moving the gas operation head to a target area of the to-be-transferred chip. According to the chip moving method, in the chip transfer process, the pose (namely the angle of the X axis or the Y axis) of the chip can be precisely adjusted, and then the die bonding precision can be improved.

Description

technical field [0001] The present application relates to the field of chip processing, in particular to a chip moving method and device. Background technique [0002] Micro LED technology, that is, LED miniaturization and matrix technology. It refers to a high-density micro-sized LED array integrated on a chip. For example, each pixel of the LED display can be addressed and individually driven to light up. It can be regarded as a miniature version of the outdoor LED display. down to the micron level. [0003] In the process of chip packaging, it is necessary to directly transfer the LED crystal film to the driver backplane without packaging. In the production of μLED, it is necessary to move millions or even tens of millions of micron-sized LED crystal grains to the driver backplane correctly and efficiently. On the circuit substrate, taking a 4K TV as an example, there are as many as 24 million chips that need to be transferred (calculated by 4000x 2000x RGB three-color)...

Claims

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Application Information

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IPC IPC(8): H01L21/683H01L21/677H01L21/67H01L25/075H01L27/15
CPCH01L21/6838H01L21/67706H01L21/67721H01L21/67144H01L25/0753H01L27/156
Inventor 郎欣林罗会才周诚
Owner SHENZHEN FONTAI IND TECH CO LTD
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