Vertical packaging structure with upper cup and lower cup
A packaging structure, vertical technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of complex process, occupying space, high cost, etc., to achieve the effect of mature and simple process and satisfying integration
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings in the embodiments of the present invention; obviously, the described embodiments are only part of the embodiments of the present invention, not all embodiments, based on The embodiments of the present invention and all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0029] see Figure 1-2 , a vertical package structure with upper and lower double cups, including a circuit substrate 1, the circuit substrate 1 is composed of a main substrate 11 and two sub-substrates 12, and the two sub-substrates 12 are respectively located on the left and right sides of the main substrate 11 and separated by a certain distance, The top of the main substrate 11 is provided with a functional chip 2, and the bottom of ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap