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High-sensitivity packaging cover plate for electric field sensor and packaging device

An electric field sensor and high-sensitivity technology, which is applied to the components of electrical measuring instruments, measuring devices, electrostatic field measurement, etc., can solve the problems of reduced applicability and accuracy of sensors, and reduced sensitivity of electric field sensors, and achieve packaging accuracy. Controlling, improving usage efficiency, and ensuring the effect of packaging accuracy

Active Publication Date: 2022-02-08
江苏浦丹光电技术有限公司
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  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a high-sensitivity packaging cover plate and packaging device for an electric field sensor, to solve the problem that the use of the packaging cover plate in the above background technology causes the sensitivity of the electric field sensor to decrease, thereby improving the applicability and accuracy of the sensor. problem of reduced sex

Method used

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  • High-sensitivity packaging cover plate for electric field sensor and packaging device
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  • High-sensitivity packaging cover plate for electric field sensor and packaging device

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Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] see Figure 1-8 , an embodiment provided by the present invention:

[0030] A high-sensitivity packaging cover plate for an electric field sensor, comprising a sealing plate 1 and a sensor chip 3, the sealing plate 1 includes a packaging substrate 11, the top and side surfaces of the packaging substrate 11 are provided with vents 16, and the lower surface of the packaging substrate 11 is The isolation plate 12 is connected, the upper surface of the pac...

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Abstract

The invention relates to the technical field of electronic components, in particular to a high-sensitivity packaging cover plate for an electric field sensor and a packaging device. The high-sensitivity packaging cover plate comprises a sealing plate and a sensor chip. The sealing plate comprises a packaging substrate. Ventilation openings are formed in the top and the side face of the packaging substrate. The lower surface of the packaging substrate is connected with an isolation plate. The upper surface of the packaging substrate is connected with a protection plate. An adjusting assembly penetrates through the interior of the packaging substrate. The adjusting assembly comprises an inner ring, the exterior of the inner ring is connected with an outer ring, and a packaging electrode is arranged in the adjusting assembly. A sealing cap is arranged below the isolation plate, and the sensor chip is connected in the sealing cap. According to the invention, the sensitivity of the sensor can be adjusted, the intensity of the sensitivity is adjusted according to the actual use condition, and the influence of high temperature on the sensitivity and stability of the sensor is effectively avoided.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to a high-sensitivity packaging cover plate for an electric field sensor and a packaging device thereof. Background technique [0002] The electric field sensor is a sensor with good anti-electromagnetic interference ability and fast response speed. It can measure the transient electric field in the high-voltage power system and can be widely used in the detection of electric field strength, providing reliable means and According to the basis, avoiding the destructive effect of strong electric field is of great significance to the launch of the transmitter. During the production process of the electric field sensor, it needs to be assembled through the packaging process. At the same time, the packaging cover plate and The caps are used to assemble the sensor. [0003] However, in the process of using the existing electric field sensor, its packaging cover usually adop...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R29/12G01R1/02G01R1/04H05K7/20
CPCG01R29/12G01R1/02G01R1/04H05K7/2039
Inventor 向美华
Owner 江苏浦丹光电技术有限公司
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